Rotatable UV Reflector for Adaptive Wafer Cleaning
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Solution Overview
Problem
Current wafer cleaning modules with fixed UV lamp reflectors either inefficiently use UV light or cause defects in materials due to direct exposure, requiring multiple tools for different materials, which is costly and space-consuming.
Innovation Solution
A wafer cleaning module with rotatable UV lamp reflectors that can adjust the direction and intensity of UV light to suit various materials, allowing for efficient surface modification without causing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fixed UV lamp reflectors are used, then the structure is simple, but UV light cannot be efficiently directed or adapted to different materials
Solution Approach 1:
The patent applies the dynamics principle by making the reflector rotatable instead of fixed. The rotatable reflector can be positioned at different angles to direct UV light appropriately for different material types, transforming a static structure into a dynamic one that adapts to varying cleaning requirements while maintaining structural simplicity.
Solution Approach 2:
The rotatable reflector design enables a single UV lamp module to serve multiple functions by directing light at different angles for different material types. This multi-functional capability eliminates the need for multiple separate cleaning modules, achieving versatility without proportionally increasing device complexity.
2Reliability
If UV light is directed directly onto the wafer surface, then cleaning effectiveness is improved, but defects may be caused in certain materials
Solution Approach 1:
The rotatable reflector allows dynamic adjustment of UV light direction. For materials sensitive to direct UV exposure, the reflector can be positioned to direct light away from the surface, using ozone for cleaning. For materials requiring stronger cleaning, the reflector can be positioned to direct UV light onto the surface, thus adapting the cleaning mechanism to prevent defects while maintaining effectiveness.
Solution Approach 2:
The system changes the parameter of UV light exposure by adjusting reflector position. This parameter change allows the same UV lamp module to operate in different modes (direct exposure vs. indirect exposure) depending on material requirements, thereby achieving effective cleaning without causing material defects.
3Adaptability or versatility
If multiple cleaning tools are used for different materials, then material-specific cleaning requirements are met, but cost and space requirements increase
Solution Approach 1:
The patent implements a universal cleaning module with a rotatable reflector that can handle different material types within a single device. This multi-functional design consolidates what would otherwise require multiple separate cleaning tools, thereby reducing fabrication space while maintaining the ability to meet material-specific cleaning requirements through reflector position adjustment.
Solution Approach 2:
The invention merges the functionality of multiple material-specific cleaning tools into a single unified module. By combining different cleaning approaches (direct UV, indirect UV with ozone) into one adjustable system, it eliminates the need for multiple separate tools, reducing both space occupation and overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of a single module for cleaning wafers with different materials by controlling UV light exposure, improving cleaning performance and reducing the risk of defects, while minimizing the need for multiple tools and space.
Implementation Method 1
a UV light source and a rotatable reflector positioned around the UV light source
Implementation Method 2
The rotatable reflector may be rotated around the UV light source to direct the UV light towards a desired target
Data Source
AI summary
A wafer cleaning module and a method for cleaning a wafer with the wafer cleaning module are disclosed. For example, the wafer cleaning module includes a wafer chuck to hold a wafer, an ozone source to provide ozone gas towards the wafer, and an ultraviolet (UV) lamp module to provide UV light. The UV lamp module includes a UV light source and a rotatable reflector around the UV light source. The rotatable reflector is movable to adjust an amount of UV light directed towards a surface of the wafer.