Rotated Connection Pad Layout for Easier Dicing Tape Peeling
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Solution Overview
Problem
The miniaturization and high density of semiconductor devices lead to finer connection pads, increasing the area of the peeling boundary of the dicing tape and hindering the peeling process, resulting in decreased yield.
Innovation Solution
The semiconductor device incorporates a circuit layer with conductive pads arranged in a specific pattern, including reference and rotated pads, where rotated pads are disposed in a series with varying rotation angles and inclination angles, minimizing the overlap with the dicing tape peeling boundary.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If connection pads are arranged at a fine pitch to achieve miniaturization and high density, then device integration is improved, but the area of the peeling boundary of the dicing tape increases, hindering peeling process
Solution Approach 1:
The patent applies asymmetry by rotating connection pads at different angles (e.g., 0°, 45°, 90°, 135°) relative to the dicing tape peeling direction. This asymmetric angular arrangement ensures that pad edges are not uniformly aligned with the peeling boundary, reducing the cumulative peeling boundary area and preventing systematic adhesion problems during the dicing process.
Solution Approach 2:
The patent implements local quality by varying the orientation of connection pads in different regions of the device. Specifically, pads in different quadrants or regions are rotated by different angles, creating localized variations in pad-edge alignment with the peeling boundary. This local differentiation optimizes peeling characteristics in each region while maintaining overall high-density integration.
2Volume of moving object
If connection pads are arranged at a fine pitch, then device miniaturization is achieved, but yield decreases due to increased peeling boundary area
Solution Approach 1:
By introducing asymmetric angular variations in pad orientation, the patent reduces the systematic alignment between pad edges and the peeling boundary. This asymmetry prevents the cumulative effect that would otherwise increase peeling boundary area, thereby maintaining manufacturing yield despite fine-pitch miniaturization.
3Ease of manufacture
If connection pads are arranged with uniform orientation, then manufacturing simplicity is maintained, but peeling boundary area increases, hindering dicing tape removal
Solution Approach 1:
The patent introduces asymmetric angular variations (e.g., 0°, 45°, 90°, 135°) in pad orientation to break the uniform alignment between pad edges and the peeling boundary. This reduces the cumulative peeling boundary area and minimizes adhesion forces, thereby reducing peeling resistance while maintaining manufacturability through systematic angular patterns.
Solution Approach 2:
The patent applies local quality by assigning different orientation angles to pads in different regions or groups. This creates localized variations in edge alignment with the peeling boundary, reducing overall peeling resistance without requiring complete randomization of pad orientations, thus balancing manufacturing simplicity with peeling performance.
Data Source
AI summary
A semiconductor device includes a plurality of connection pads having a polygonal planar shape, and edges defining a front surface on which the plurality of connection pads are disposed. The plurality of connection pads include reference pads in which a first center line passing through a vertex of the planar shape coincides with a reference line orthogonal to the adjacent edges, and first to nth rotated pads sequentially disposed from one side of one of the reference pads, and each second center line passing through the vertex of the planar shape of the first to nth rotated pads has a rotation angle (βn) according to the following equation with respect to the reference line given by βn=n(45°/N). In the equation above, n represents an arrangement order of the first to nth rotated pads, and N is the number of the first to nth rotated pads.