Rotating Adhesive Wafer Mounts for Low-Stress Die Handling
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Solution Overview
Problem
Existing semiconductor wafer handling technologies face challenges such as mobility issues due to vacuum leakage and stress induction from clamping, which affect the handling and transport of wafers and dies.
Innovation Solution
The use of adjustable adhesive mounts (AAMs) with adjustable adhesive regions (AARs) that apply varying adhesion forces through rotation, counterrotation, linear translation, or expansion/contraction to securely hold and release semiconductor wafers and dies without mechanical clamping or continuous vacuum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum pickup tools are used to hold wafers, then wafers can be secured for handling, but mobility is reduced due to vacuum leakage
Solution Approach 1:
The patent replaces the vacuum-based mechanical holding system with an adhesive-based system. The adhesive mount uses adhesive material that can be activated to bond to the wafer surface, providing reliable holding without requiring continuous vacuum. This substitution eliminates vacuum leakage issues and improves mobility while maintaining wafer security during handling and transport.
2Strength
If clamping mechanisms are used to secure wafers, then wafers can be held firmly, but stress is induced on the wafer
Solution Approach 1:
The patent changes the fundamental parameter of how holding force is applied - from mechanical clamping (contact force at edges) to adhesive bonding (distributed force across surface). The adhesive material distributes the holding force uniformly across the wafer surface, eliminating concentrated stress points while maintaining firm holding. This parameter change resolves the contradiction between holding strength and wafer stress.
3Strength
If adjustable adhesive regions are made larger to increase adhesion, then wafer holding strength improves, but the device complexity increases
Solution Approach 1:
The patent divides the adhesive mount into multiple discrete adjustable adhesive regions rather than using a single large adhesive area. Each region can be independently controlled or adjusted. This segmentation allows the system to achieve high total adhesion force through multiple smaller regions while keeping each individual region simple in structure, thereby reducing overall device complexity while maintaining or enhancing holding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
AAMs enhance the handling and transport of wafers and dies by providing strong, tunable adhesion that maintains stability over time, reducing stress and mobility challenges, and improving yield and cost-effectiveness in semiconductor manufacturing.
Implementation Method 1
a first set of one or more adjustable adhesive regions located on the first rotatable structure and in contact with the semiconductor wafer portion, where each adjustable adhesive region in the first set of adjustable adhesive regions is configured to increase its adhesion to the semiconductor wafer portion during the first rotation and to decrease its adhesion to the semiconductor wafer portion during the first counterrotation
Data Source
AI summary
An apparatus for securing a semiconductor wafer portion (SWP) comprises: a first rotatable structure (RS) configured to perform a first rotation and a first counterrotation about a first axis; a second RS configured to perform a second rotation and a second counterrotation about a second axis; a first set of one or more adjustable adhesive regions (AARs) located on the first RS and in contact with the SWP, where each AAR in the first set of AARs is configured to increase its adhesion to the SWP during the first rotation and to decrease its adhesion during the first counterrotation; and a second set of one or more AARs located on the second RS and in contact with the SWP, where each AAR in the second set of AARs is configured to increase its adhesion to the SWP during the second rotation and decrease its adhesion during the second counterrotation.