Rotating Alignment Pin for Semiconductor Substrate Positioning
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Solution Overview
Problem
Existing substrate alignment systems are inefficient and prone to misalignment, leading to process failures in semiconductor device manufacturing, as they often require excessive time and result in substrate deviation due to friction and improper contact points.
Innovation Solution
A substrate alignment apparatus featuring rotatable guide units with conical or frusto-conical alignment pins and a support surface, where the alignment pins rotate to minimize kinetic energy loss and wear, optimizing the height of the guide unit to half the substrate thickness for rapid and accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the guide unit body height is increased to prevent substrate deviation, then alignment reliability is improved, but alignment time increases and substrate may fail to descend properly
Solution Approach 1:
The guide unit body is designed to rotate about a vertical axis during substrate alignment. This dynamic motion transforms the static friction problem into a dynamic interaction where the rotating body periodically contacts different points on the substrate bevel, reducing cumulative friction and enabling reliable alignment within the optimal time frame without substrate descent failure
Solution Approach 2:
The guide unit body employs a curved outer surface that contacts the substrate bevel. This curvature allows for more uniform pressure distribution and smoother rolling/rotating contact compared to flat surfaces, improving both reliability and speed of alignment by reducing frictional resistance during the descent process
2Manufacturing precision
If the guide unit body height is increased to ensure proper substrate positioning, then alignment precision is improved, but friction with substrate increases causing wear and reduced durability
Solution Approach 1:
The rotating guide unit body dynamically redistributes contact points on the substrate bevel during alignment. This continuous rotation prevents concentrated wear at any single location, maintaining alignment precision over extended periods while significantly extending guide unit durability through reduced frictional wear
Solution Approach 2:
The guide unit's rotational motion during substrate descent serves a dual function: it achieves precise alignment while simultaneously self-lubricating by varying contact points. The system uses the substrate's own weight and motion to create the rotating contact pattern that reduces wear, without requiring external lubrication mechanisms
3Device complexity
If conventional guide units with fixed bodies are used for substrate alignment, then structural simplicity is maintained, but friction with substrate causes misalignment and process failures
Solution Approach 1:
The guide unit body is designed to rotate about a vertical axis during substrate alignment. This dynamic motion transforms the static friction problem into a dynamic interaction where the rotating body periodically contacts different points on the substrate bevel, reducing cumulative friction and enabling reliable alignment within the optimal time frame without substrate descent failure
Solution Approach 2:
The guide unit body employs a curved outer surface that contacts the substrate bevel. This curvature allows for more uniform pressure distribution and smoother rolling/rotating contact compared to flat surfaces, improving both reliability and speed of alignment by reducing frictional resistance during the descent process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces alignment time and error, enhances durability by minimizing wear, and ensures precise substrate positioning, thereby improving the efficiency and reliability of semiconductor processing.
Implementation Method 1
the alignment pin is rotatable about a central axis of the alignment pin relative to the support surface of the stationary part... the alignment pin rotates to minimize kinetic energy loss and wear
Data Source
AI summary
Disclosed are a substrate alignment apparatus, a substrate processing apparatus, and a substrate processing method using the substrate alignment apparatus. The substrate alignment apparatus and the substrate processing apparatus include a support plate and a plurality of guide units coupled to the support plate to align a position of the substrate. Each of the guide units includes an alignment pin for aligning the substrate in place and a stationary body having a support surface for supporting an edge region of the substrate aligned, the stationary part being fixedly coupled to the support plate. The alignment pin is rotatable about a central axis of the alignment pin relative to the support surface of the stationary part, thereby rapidly aligning the substrate and thus preventing the substrate transferred between a plurality of process chambers by a transfer robot from being separated or having a negative influence on other apparatuses.