Rotating Arm Alignment for Semiconductor Test Sockets
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Solution Overview
Problem
Conventional test sockets struggle with precise alignment of small semiconductor packages due to variations in package dimensions and tightly-packed electrical contacts, leading to false identification of good parts as defective during electrical testing.
Innovation Solution
The implementation of rotating arms with indexing features that move toward the center of the test socket, allowing for precise alignment by engaging the corners of the semiconductor package, rather than relying on edge alignment, which reduces misalignment and improves contact accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional test sockets use a central cutout for package alignment, then the structure is simple, but alignment precision deteriorates when package dimensions vary
Solution Approach 1:
The patent employs rotating arms that can dynamically adjust their position and orientation to accommodate packages with varying dimensions. The arms rotate about vertical axes and can be positioned at different angular locations, allowing the socket to adapt to packages that are slightly smaller than expected while maintaining precise alignment with the electrical contacts.
2Volume of moving object
If semiconductor packages are made smaller to reduce size, then product miniaturization is achieved, but alignment precision deteriorates due to tighter tolerances
Solution Approach 1:
The patent introduces rotational movement in the vertical dimension (rotation about vertical axes) to solve the horizontal alignment problem. By allowing the arms to rotate and adjust their angular position, the system adds a degree of freedom that enables precise alignment in the horizontal plane despite the reduced package size and tighter tolerances.
3Reliability
If pogo pins are kept in fixed positions, then the structure is simple, but contact reliability deteriorates due to misalignment
Solution Approach 1:
The rotating arms serve as an intermediary mechanism between the fixed pogo pins and the semiconductor package. The arms can rotate and adjust their position to compensate for package dimension variations, ensuring that the fixed pogo pins remain properly aligned with the electrical contacts on the package, thereby maintaining contact reliability without requiring the pogo pins themselves to be movable.
Data Source
AI summary
A test socket comprises a test socket body with a central opening configured to receive a device under test (DUT) including at least one arm opening in the test socket body; and at least one rotating arm disposed in the arm opening.