Rotating Blade Groove Segmentation for Flexible Substrate Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing circuit boards and light-emitting devices using flexible substrates often result in damage to electrodes and display regions due to inaccurate depth control during substrate removal, leading to unreliable and damaged wiring layers.
Innovation Solution
A method involving a processing member with a terminal electrode, separation layer, bonding layer, and second substrate, where grooves of different depths are formed using a rotating blade to carefully expose the terminal electrode, minimizing damage by controlling the cutting process with precise depth and corner shapes to reduce peripheral layer damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If part of the flexible substrate is removed by laser light, then the substrate can be separated, but the laser light might transmit through the substrate and damage the wiring and electrode below
Solution Approach 1:
The substrate removal process is divided into multiple depth levels using grooves of different depths (first groove and second groove). The first groove is formed to a first depth, and the second groove is formed to a second depth greater than the first depth. This segmentation prevents laser light from transmitting through the entire substrate thickness and damaging underlying layers.
Solution Approach 2:
Grooves are formed in the flexible substrate before complete substrate removal. These grooves serve as preliminary structural modifications that control the depth and location of substrate removal, preventing excessive penetration and damage to underlying wiring and electrodes.
2Manufacturing precision
If part of the flexible substrate is removed by an edged tool, then the substrate can be separated, but the processing accuracy in the depth direction is low and wiring or layers below might be damaged
Solution Approach 1:
The substrate removal is segmented into multiple stages with grooves at different depths. The first groove is formed at a first depth, and the second groove is formed at a second depth greater than the first depth. This multi-level segmentation enables precise depth control and prevents damage to underlying layers.
3Ease of operation
If the substrate is removed to expose the electrode, then external electrodes can be connected, but damage to the electrode and display region occurs
Solution Approach 1:
Grooves of different depths are formed in the flexible substrate before substrate removal to define the exposure area of the electrode. The first groove and second groove create a controlled opening that exposes only the necessary portion of the electrode while protecting surrounding areas from damage.
Solution Approach 2:
The electrode exposure process is segmented into controlled removal steps defined by grooves at different depths. This segmentation allows selective exposure of the electrode for connection purposes while maintaining the integrity of the electrode and surrounding display region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces electrode and display region damage, enhancing the reliability and accuracy of circuit board and light-emitting device manufacturing by ensuring minimal damage to underlying layers during substrate removal, resulting in a more reliable and efficient production process.
Implementation Method 1
forming a groove in the processing member using a blade capable of cutting processing by being rotated
Data Source
AI summary
A circuit board in which damage to an electrode is reduced or a light-emitting device in which damage to an electrode is reduced is manufactured. A method for manufacturing the circuit board or the light-emitting device includes the following steps: preparing a processing member including a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member using a blade capable of cutting processing by being rotated; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.