Rotating Bonder Apparatus for Discrete Substrate Bonding
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Solution Overview
Problem
The manufacturing process for disposable absorbent articles, such as diapers, is inefficient as it requires switching equipment or making significant modifications to produce different sizes, which is costly and time-consuming.
Innovation Solution
A bonder apparatus with rotating manifolds and a nozzle plate system that supplies heated fluid through apertures to partially melt and bond substrates, allowing for the production of various sizes on the same equipment by controlling the release of heated fluid and pressure to form discrete bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the same equipment is used to manufacture different sizes of absorbent articles, then manufacturing efficiency and cost-effectiveness improve, but the device complexity increases due to the need for adjustable mechanisms
Solution Approach 1:
The bonder apparatus incorporates adjustable mechanisms that allow dynamic reconfiguration for different product sizes. The radius adjustment mechanism enables the equipment to adapt between producing smaller and larger absorbent articles by changing the operational radius, thereby maintaining manufacturing efficiency across product variants without requiring complete equipment replacement.
Solution Approach 2:
The system utilizes parameter changes to accommodate different product sizes. By adjusting physical parameters such as the operational radius and bonding parameters, the same equipment can efficiently produce various sizes of absorbent articles, resolving the contradiction between maintaining productivity and avoiding increased device complexity.
2Adaptability or versatility
If equipment is switched or modified to produce different sizes of absorbent articles, then product versatility improves, but manufacturing time and costs increase
Solution Approach 1:
The bonder apparatus is designed as a universal device capable of producing multiple sizes of absorbent articles through adjustment mechanisms. This multi-functionality allows the same equipment to handle different product specifications without requiring equipment switching, thereby maintaining manufacturing time efficiency while achieving product versatility.
Solution Approach 2:
The equipment includes pre-configured adjustment mechanisms that allow rapid reconfiguration between different product sizes. These preliminary design features enable quick adaptation to different manufacturing requirements without time-consuming modifications, resolving the contradiction between versatility and manufacturing time.
3Adaptability or versatility
If the radius of the bonder apparatus is adjusted, then the ability to produce different sizes improves, but the mechanical complexity of the adjustment mechanism increases
Solution Approach 1:
The radius adjustment mechanism employs dynamic design principles, allowing the bonder apparatus to change its operational radius through controlled mechanical adjustments. This dynamic capability enables size flexibility while maintaining relatively simple mechanism design through standardized components and controlled adjustment ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient production of absorbent articles of different sizes on the same equipment, reducing manufacturing costs and time by mechanically deforming substrates to form strong, discrete bonds.
Implementation Method 1
a jet of heated fluid is delivered from an aperture to at least partially melt the overlapping substrate portions
Implementation Method 2
the jet of heated fluid penetrates the substrate portions and at least partially melts the overlapping substrate portions
Data Source
Figure 1
Figure 2~3B
Figure 4
AI summary
A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may advance toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and is configured to radially traverse based on the process product pitch of the substrate assembly. The bonder apparatus may include a plurality of manifolds positioned about the axis of rotation. The substrate assembly may be advanced onto the bonder apparatus such that the substrate assembly is disposed on the plurality of manifolds. The manifolds may heat fluid and release the same onto the trailing edge portion and the leading edge portion of the substrate assembly. The heated portion of the substrate assembly may then be bonded forming a seam.