Rotating Bonder Apparatus for Variable Substrate Bonding
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Solution Overview
Problem
The manufacturing process for disposable absorbent articles, such as diapers, faces challenges in efficiently bonding different-sized substrates on the same equipment, leading to increased costs and time consumption due to the need for equipment modifications or switching.
Innovation Solution
A method and apparatus for transferring and bonding substrates involve rotating a bonder apparatus with support surfaces to receive and process substrate assemblies, using a fluid jet to partially melt and compress substrates, and applying pressure to create discrete bonds, allowing for the formation of side seams in various diaper configurations without requiring significant equipment changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If equipment is modified or switched to manufacture different sized articles, then manufacturing flexibility is improved, but production time and costs increase
Solution Approach 1:
The converting apparatus is designed with adjustable components including variable diameter rollers and reconfigurable bonding mechanisms that can process multiple diaper sizes using the same equipment, eliminating the need for equipment switching while maintaining manufacturing flexibility across different product specifications
2Adaptability or versatility
If equipment modifications are made to produce different sized articles, then manufacturing versatility is improved, but manufacturing costs increase
Solution Approach 1:
The apparatus employs universal bonding mechanisms and adjustable substrate handling systems that can accommodate various diaper sizes without requiring costly equipment modifications, achieving manufacturing versatility through design flexibility rather than hardware changes
Solution Approach 2:
The converting apparatus incorporates dynamically adjustable parameters including variable bonding pressure, adjustable substrate tension, and reconfigurable roller positions that allow the same equipment to efficiently produce different diaper sizes without modification costs
3Device complexity
If substrate bonding is performed without maintaining process tension, then equipment complexity is reduced, but substrate deformation increases
Solution Approach 1:
The bonding process maintains controlled substrate tension as a critical process parameter throughout the bonding operation, preventing substrate deformation and ensuring manufacturing precision while using standard equipment without excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient bonding of substrates of different sizes on the same equipment, reducing production costs and time by maintaining process tension and minimizing substrate deformation, thus facilitating the production of diverse absorbent article sizes.
Implementation Method 1
a jet of heated fluid is delivered from an orifice to at least partially melt the overlapping substrate portions
Implementation Method 2
The jet of heated fluid penetrates the substrate portions and at least partially melts the overlapping substrate portions
Implementation Method 3
Pressure may then be applied at the overlap area thereby joining the substrate portions together
Implementation Method 4
The jet of heated fluid penetrates the substrate portions
Data Source
AI summary
A method for mechanically deforming a substrate assembly. The substrate assembly may advance at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between a first member and a second member. The first and second members may rotate at the first velocity and may be separated by an initial angle. The first member may receive a leading portion and the second member may receive a trailing portion of the substrate assembly. The first member may decelerate to a second velocity, and, subsequently, the second member may decelerate to the second velocity. The first member and the second member may be separated by a process angle, which may be different than the initial angle. A central portion of the substrate assembly may be relaxed while the leading and trailing portion may be held at a process tension. The substrate assembly may then undergo one or more processes.