Rotating Bonding Stage for Multi-Height Semiconductor Laser Chips
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Solution Overview
Problem
Conventional bonding apparatuses are unable to effectively bond semiconductor laser chips with multiple bonding sections of different heights without complicating the mechanism, as they assume uniform height positions for bonding, leading to inefficiencies in bonding processing.
Innovation Solution
A bonding apparatus with a rotary mechanism unit that rotates the work-holder about a reference orientation, allowing the bonding means to move relative to the placement surface and correct differences in separation distances of bonding points, enabling bonding on multiple faces with varying heights without altering the moving distance of the bonding means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional bonding apparatuses assume uniform height positions for bonding, then the bonding mechanism remains simple, but bonding processing becomes inefficient for chips with multiple bonding sections of different heights
Solution Approach 1:
The bonding stage is made rotatable about a vertical axis, allowing dynamic adjustment of the chip orientation to present different bonding faces to the bonding tool. This dynamic repositioning enables efficient bonding of multiple faces without requiring complex vertical repositioning mechanisms, thus improving productivity while maintaining relatively simple device structure.
Solution Approach 2:
Instead of adjusting bonding positions primarily in the vertical dimension (Z-axis), the invention introduces rotational movement in the horizontal plane (XY-plane). By rotating the bonding stage, different bonding sections on various faces of the chip can be brought into the bonding position, effectively using angular positioning to solve the height variation problem and improve processing efficiency.
2Adaptability or versatility
If the bonding stage is rotated to access multiple bonding faces, then bonding versatility improves, but positioning precision and vibration control become challenging
Solution Approach 1:
Position sensors detect the actual angular position of the rotatable bonding stage, and this feedback information is used by the control system to compensate for positioning errors and ensure precise alignment of bonding sections with the bonding tool, maintaining manufacturing precision while enabling versatile multi-face bonding.
Solution Approach 2:
The rotatable stage design allows the system to automatically reposition different bonding faces into the bonding position through controlled rotation, eliminating the need for manual repositioning or complex external positioning mechanisms, thereby achieving both versatility and precision.
3Device complexity
If the bonding means moves distance is kept constant, then mechanism simplicity is maintained, but bonding sections at different heights cannot be accessed efficiently
Solution Approach 1:
The rotatable stage enables dynamic repositioning of bonding sections in the horizontal plane, allowing the bonding tool to access multiple bonding faces without changing its vertical position or moving distance. This maintains mechanism simplicity while significantly improving bonding processing speed by eliminating repeated vertical repositioning operations.
Solution Approach 2:
The invention shifts the repositioning operation from the vertical dimension to the horizontal dimension through stage rotation. The bonding tool maintains a constant moving distance vertically, while the rotatable stage brings different bonding sections into reach by rotating in the horizontal plane, thus maintaining simplicity while enhancing productivity.
Data Source
AI summary
Bonding processing for a plurality of bonding points of different distances with respect to a reference position (origin) of an object to be bonded without changing a moving distance of bonding means is provided. The bonding means, a bonding stage having a work-holder and a rotary mechanism unit for rotating the work-holder, and a control unit for controlling rotation of the work-holder are provided. The bonding means is movable relative to a placement surface of the work-holder in a reference orientation and has a reference position on its moving direction. The plurality of bonding points include bonding points of different separation distances from the reference position along the moving direction while the object to be bonded is being held to the work-holder in the reference orientation. The control unit corrects differences in the separation distances of the plurality of bonding points by controlling rotation of the work-holder.