Contactless Data Transfer Across Rotating Boundaries

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional slip-ring assemblies used for data transfer between rotating components in CT imaging and other applications are prone to dust generation, wear, noise, and high manufacturing costs, while contactless assemblies face signal distortion and complexity issues due to large diameters.

Innovation Solution

A data communication system comprising circuit board assemblies with conductive and dielectric layers separated by insulating layers, forming an electromagnetic coupling to transmit data wirelessly across an airgap, with a support structure maintaining the relative position of the components to minimize signal attenuation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional slip-ring assemblies are used for data transfer between stator and rotor, then reliable physical contact is achieved, but dust generation, wear, and noise increase

Engineering Contradiction:
Improvedata transfer reliabilityVSAvoiddust generation and wear
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the mechanical slip-ring assembly with an electromagnetic coupling system consisting of a transceiver on the rotor and a receiver on the stator. This substitution eliminates physical contact between moving parts, thereby eliminating dust generation and wear while maintaining reliable data transfer through electromagnetic waves across the airgap.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Object-generated harmful factors

If contactless assemblies are used to transfer data across the airgap, then dust and wear are eliminated, but signal distortion increases due to large diameter

Engineering Contradiction:
Improvedust and wear eliminationVSAvoidsignal distortion
Core Design Contradiction:
Object-generated harmful factorsVSLoss of information

Solution Approach 1:

The patent segments the data communication into multiple components: a transceiver assembly on the rotor containing both transmitting and receiving elements, and a corresponding receiver assembly on the stator. This segmentation allows the system to maintain effective electromagnetic coupling across the airgap while reducing the overall diameter and minimizing signal distortion.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an electromagnetic field as an intermediary to transfer data across the airgap between the rotor and stator. The transceiver converts electrical signals to electromagnetic waves that propagate through the airgap to the receiver, which converts them back to electrical signals, thereby enabling contactless data transfer without direct physical connection.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If conventional slip-ring assemblies are used, then data transfer is achieved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvedata transfer capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the complex mechanical slip-ring assembly with simpler electromagnetic coupling components - a transceiver unit on the rotor and a receiver unit on the stator. These components are easier to manufacture with standard electronics and antenna technologies, reducing both manufacturing complexity and cost while maintaining reliable data transfer.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Power

If conventional slip-ring assemblies are used, then power and data transfer are achieved, but noise increases

Engineering Contradiction:
Improvepower and data transferVSAvoidnoise
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the mechanical contact-based slip-ring assembly with an electromagnetic coupling system that transfers power and data wirelessly across the airgap. This eliminates mechanical friction and contact between moving parts, thereby eliminating noise generation while maintaining effective power and data transfer capabilities.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces signal attenuation and manufacturing complexity, providing efficient and reliable data transfer with reduced noise and cost compared to conventional methods, while maintaining effective communication across small airgaps.

Implementation Method 1

A data communication system comprises circuit board assemblies with conductive and dielectric layers separated by insulating layers, forming an electromagnetic coupling to transmit data wirelessly across an airgap

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS9713454B2Data transfer across a rotating boundary
Publication Date: 2017.07.25 ANALOGIC CORP
  • US9713454B2 patent drawing
  • US9713454B2 patent drawing
  • US9713454B2 patent drawing

AI summary

A computed tomography (CT) imaging modality includes a stator and a rotor that rotates relative to the stator. The CT imaging modality includes a radiation source and a detector array for detecting at least some of the radiation. A first data communication component is coupled to the stator or the rotor for transmitting data between the stator and the rotor. The first data communication component includes a first circuit board assembly including a first conductive layer and a first dielectric layer and a second circuit board assembly including a second conductive layer and a second dielectric layer. The second conductive layer of the second circuit board assembly faces the first conductive layer of the first circuit board assembly. An insulating layer is disposed between the first conductive layer of the first circuit board assembly and the second conductive layer of the second circuit board assembly.