Rotating Carrier for Upright Wafer Processing

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Solution Overview

Problem

Existing wafer processing methods are inefficient due to high equipment costs and time-consuming wafer conveyance and positioning, which hinder the production efficiency of wafer processing lines.

Innovation Solution

A liftable, lowerable, turnable, and rotatable carrier allows for simultaneous upright and horizontal processing of wafers during spraying, rinsing, and drying steps, reducing the need for frequent station repositioning and conveyance, thereby accelerating the manufacturing process and optimizing equipment usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple stations with specific devices are used for each processing step, then processing functionality is ensured, but equipment costs increase and conveyance time is extended

Engineering Contradiction:
Improveproduction efficiencyVSAvoidequipment costs
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges multiple processing functions (spraying, rinsing, drying) into a single integrated station with a multifunctional carrier. The carrier can perform spraying, rinsing, and drying operations sequentially within one station, eliminating the need for separate stations for each function and reducing overall equipment complexity while maintaining processing capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The carrier is designed as a universal platform that can perform multiple processing functions (spraying, rinsing, drying) and accommodate different wafer orientations (horizontal and upright). This multi-functional carrier replaces the need for multiple specialized devices, reducing equipment costs while maintaining full processing functionality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If robotic hands convey wafers between stations, then processing steps are completed, but conveyance time increases and positioning repositioning is required

Engineering Contradiction:
Improveproduction efficiencyVSAvoidconveyance time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent combines multiple processing steps (spraying, rinsing, drying) into a single station, eliminating the need for wafer conveyance between multiple stations. The carrier remains in one location while performing all processing functions sequentially, completely eliminating conveyance time and positioning repositioning requirements.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The carrier performs all processing functions (spraying, rinsing, drying) autonomously within a single station without requiring external robotic hands for conveyance. The carrier lifts, lowers, turns, and rotates itself to complete processing steps, eliminating dependency on robotic conveyance systems.

Inventive Principle:
Principle #25Self-service

3Loss of time

If wafer processing is performed on the same carrier with lifting and lowering, then conveyance time is reduced, but device complexity increases

Engineering Contradiction:
Improveconveyance timeVSAvoidcarrier mechanism complexity
Core Design Contradiction:
Loss of timeVSDevice complexity

Solution Approach 1:

The carrier is designed as a universal platform with integrated lifting, lowering, turning, and rotating mechanisms that enable it to perform multiple processing functions within a single station. This multi-functional design eliminates the need for multiple separate devices and their associated conveyance systems, reducing overall system complexity while eliminating conveyance time.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentEP4148773B1Wafer processing method and carrier
Publication Date: 2024.12.11 SCIENTECH CORPORATION
  • EP4148773B1 patent drawingFigure 1
  • EP4148773B1 patent drawingFigure 2~3
  • EP4148773B1 patent drawingFigure 4

AI summary

This disclosure provides a wafer processing method having the following steps: providing a wafer (10), an immersion device (100), a carrier (200), and a spray device (300); turning the wafer (10) from a horizontal manner to an upright manner; upright placing the wafer (10) into the immersion device (100) for immersion; taking the wafer (10) out from the immersion device (100) and placing that onto the carrier (200) horizontally; spraying a liquid on the wafer (10) by the spray device (300); rinsing the wafer (10); rotating the carrier (200) to dry the wafer (10). Multiple steps for processing the wafer (10) may be performed on the same carrier (200) to accelerate the process.