Rotating Cleaning Jig for Substrate Processor Cup
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Solution Overview
Problem
In substrate processing apparatuses that do not have a dedicated nozzle for supplying cleaning liquids to the top surface of wafers, components higher than the bottom surface remain uncleaned, leading to particle contamination and increased device costs when attempting to use existing cleaning substrates.
Innovation Solution
A method utilizing a first cleaning jig with a disk-shaped lower member and an upper member forming a gap, where the cleaning liquid is ejected from the bottom side during rotation to flow through the opening and out via the gap, effectively cleaning components around the substrate processing apparatus, including those higher than the bottom surface without a top-side cleaning liquid supply unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dedicated cleaning liquid nozzle is provided to supply cleaning liquid to the top surface of the wafer, then the upper portion of the cup can be cleaned, but the device cost increases
Solution Approach 1:
The invention makes the existing cleaning substrate multi-functional by enabling it to clean both the lower portion (via gap flow) and upper portion (via upward flow through opening) of the cup. This eliminates the need for a separate dedicated nozzle, achieving full cleaning coverage while avoiding additional device cost and complexity.
Solution Approach 2:
The cleaning substrate serves itself by using its own structure (lower member with opening and gap) to deliver cleaning liquid to multiple areas. The bottom-side ejection mechanism allows the same component to perform multiple cleaning functions that would otherwise require separate dedicated components.
2Device complexity
If cleaning liquid is supplied only from the bottom side of the cleaning substrate, then the upper portion of the cup can be cleaned without additional nozzles, but the cleaning liquid must be ejected upward against gravity
Solution Approach 1:
The invention utilizes periodic rotation of the cleaning substrate to create centrifugal force, which periodically directs the cleaning liquid upward and outward. This periodic rotational action provides the necessary energy to overcome gravity and deliver liquid to the upper cup portions without requiring continuous high-energy pumping or additional nozzles.
Solution Approach 2:
The invention uses hydraulic principles by ejecting cleaning liquid through a pressurized system from the bottom side, utilizing fluid pressure and flow dynamics to propel the liquid upward through the opening in the lower member and out through the gap, overcoming gravitational force through controlled pressure application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables thorough cleaning of components at various heights within the substrate processing apparatus, reducing particle contamination and device costs by using a cost-effective cleaning method that does not require a dedicated top-side cleaning liquid supply unit.
Implementation Method 1
rotating the substrate holding unit around a vertical axis to rotate the first cleaning jig; and ejecting a cleaning liquid toward the first cleaning jig from a bottom side of the first cleaning jig while the first cleaning jig is rotated
Implementation Method 2
the cleaning liquid is passed through the opening of the lower member to reach a bottom surface of the upper member, in which the cleaning liquid that has reached the bottom surface of the upper member flows out toward outside of the first cleaning jig via the gap between the upper member and the lower member
Data Source
AI summary
Disclosed is a method of cleaning components of a substrate processing apparatus The components of the substrate processing apparatus are cleaned by using a first cleaning jig including a disk-shaped lower member, and a disk-shaped upper member connected to the lower member and forming a gap between the upper member and the lower member. The lower member of the first cleaning jig is held by the substrate holding unit to rotate the first cleaning jig. The cleaning liquid is ejected toward the first cleaning jig from a bottom side of the first cleaning jig while the first cleaning jig is rotated. The cleaning liquid flows out toward outside of the first cleaning jig via the gap between the upper member and the lower member by a centrifugal force, and the components of the substrate processing apparatus are cleaned by the cleaning liquid that has flowed out.