Rotating Cutting Stage for Automatic Foreign Matter Removal
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Solution Overview
Problem
Current cutting stages face challenges in efficiently removing foreign materials, leading to reduced cutting yield and limited automation capabilities, as existing methods like air gun, brush, and belt drive cleaning are labor-intensive, damage equipment, and fail to completely remove small volume foreign matters.
Innovation Solution
A stage with a support substrate and a driving unit that rotates around a first direction parallel to the board surface, allowing foreign matters to slide off due to gravity, enhancing automation and reducing consumables, with optional features like conveyor belts and vacuum adsorption for improved precision and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air gun, brush, or belt drive cleaning methods are used to remove foreign matters, then some cleaning effect is achieved, but the methods are labor-intensive, damage equipment, and fail to completely remove small volume foreign matters
Solution Approach 1:
The support substrate is designed to rotate automatically after the cutting process, using its own motion to generate centrifugal force that removes foreign matters. This self-cleaning mechanism eliminates the need for external cleaning devices and manual intervention, achieving complete removal of foreign matters including small volume particles while fully automating the process.
Solution Approach 2:
The rotation of the support substrate creates centrifugal force and mechanical motion that effectively removes foreign matters from the surface. This mechanical action is more effective than static cleaning methods and can completely remove even small volume foreign matters without damaging the stage or requiring consumables.
2Reliability
If complex cleaning devices are added to improve foreign matter removal ability, then cleaning effectiveness improves, but device complexity increases and automation capability is limited
Solution Approach 1:
The support substrate's own rotation is utilized to remove foreign matters, eliminating the need for additional cleaning devices. This self-service approach maintains simple stage structure while achieving complete foreign matter removal effectiveness.
Solution Approach 2:
The support substrate serves dual functions: it supports the flat plate during cutting and simultaneously removes foreign matters through rotation. This multi-functionality eliminates the need for separate cleaning devices, maintaining structural simplicity while improving cleaning effectiveness.
3Productivity
If traditional cleaning methods are used, then some foreign matters are removed, but cutting yield rate remains limited due to incomplete removal of foreign matters
Solution Approach 1:
The rotation of the support substrate generates centrifugal force and mechanical motion that completely removes foreign matters from the stage surface. This mechanical action ensures no foreign matters remain to cause scratches or misalignment, achieving cutting yield rate of 99.5% or higher.
Solution Approach 2:
The support substrate is rotated to change its operational state from static to dynamic. This parameter change enables the generation of centrifugal force that effectively removes foreign matters, completely clearing the stage surface and maximizing cutting yield rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high automation, reduced production costs, and increased cutting yield by simplifying foreign matter removal, achieving a cutting yield rate of 99.5% or higher without human intervention.
Implementation Method 1
a driving unit disposed on the support substrate, and the driving unit is configured to drive the support substrate to rotate around a first direction in a board surface of the support substrate so as to remove foreign matters on the support substrate
Data Source
Figure 1a~1b
Figure 1c~2a
Figure 2b~3
AI summary
A stage for cutting process and cutting method thereof, processing apparatus are disclosed. The stage includes a support substrate (100) and a driving unit (200) disposed on the support substrate (100). The driving unit (200) is configured to drive the support substrate (100) to rotate around a first direction (800) in a board surface of the support substrate (100) so as to remove foreign matters (2) on the support substrate (100). The driving unit (200) disposed in the stage can drive the rotation of the stage to allow foreign matters (2) on the stage to automatically slide down, which can improve the automation ability of the stage and the clearance rate of foreign matters and improve cutting yield of product.