Rotating Outer Tube Developer Sprayer for Wafer Precision
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Solution Overview
Problem
Current developer spraying methods in photolithography, such as spray development, face challenges in achieving precise and uniform application, leading to wastage of developer solution and uneven exposure, which affects critical dimension control and environmental sustainability.
Innovation Solution
A developer spraying device comprising a hollow inner tube unit with nozzles and a rotating hollow outer tube unit that selectively exposes or shades the nozzles, ensuring developer is applied only to the top surface of the wafer, reducing wastage and optimizing developer usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the nozzles are arranged in a straight line and the developer spraying device passes through the top of the wafer, then the developer can be sprayed on the top surface of the wafer, but the developer will also be sprayed on the outer surrounding region outside the wafer surface, causing waste
Solution Approach 1:
The patent applies the dynamics principle by making the outer tube rotatable relative to the inner tube, allowing the nozzle array to dynamically adjust its exposure to the wafer surface. By rotating the outer tube, the system can control which nozzles are exposed and actively spray developer, versus which nozzles are shielded and remain inactive. This dynamic adjustment enables precise targeting of the developer spray to match the wafer's circular boundary, preventing waste in the outer surrounding region while maintaining manufacturing precision through controlled spray activation.
2Reliability
If the developer is sprayed in a wide pattern to ensure full coverage, then uniform development is achieved, but excessive developer is wasted in areas outside the wafer
Solution Approach 1:
The patent applies the local quality principle by creating a non-uniform spray pattern through selective nozzle exposure. The rotatable outer tube allows different nozzles to be exposed or shielded based on their position relative to the wafer, ensuring that developer is sprayed only where needed (on the wafer surface) and not in surrounding areas. This localizes the spray quality to match the wafer's geometry, achieving reliable coverage of the target area while eliminating waste in non-target regions.
3Device complexity
If a simple straight-line nozzle arrangement is used, then the device structure is simple, but it cannot control where the developer is sprayed, leading to redundancy outside the wafer
Solution Approach 1:
The patent introduces a moderate level of complexity by adding a rotatable outer tube mechanism, which provides dynamic control over nozzle exposure. This mechanical rotation capability allows the system to selectively expose or shield nozzles based on their angular position, enabling precise control of developer spray location. The added complexity is justified by the significant reduction in developer loss, as the system can now match the spray pattern to the wafer's circular boundary and prevent waste in outer regions.
Data Source
AI summary
A developer spraying device for reducing usage quantity of developer includes a hollow inner tube unit and a hollow outer tube unit. The hollow inner tube unit includes a hollow inner tube and a plurality of nozzles communicating an inner portion of the hollow inner tube with external world. The hollow inner tube has at least one liquid receiving space formed therein, and the liquid receiving space is filled with the developer. The hollow outer tube unit includes a hollow outer tube disposed around the hollow inner tube and tightly mated with the hollow inner tube and an opening formed on the hollow outer tube and communicating with an inner portion of the hollow outer tube. The hollow outer tube is selectively rotated clockwise or anticlockwise relative to the hollow inner tube, thus the nozzles are selectively exposed from the opening or shaded by the hollow outer tube.