Rotating Dual-Surface Robotic Actuator for Wafer and Ring Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Contemporary silicon wafer handling and packaging systems face challenges in automating the handling of multiple silicon wafers and rings, particularly in creating and unpacking alternating stacks, due to adhesive forces causing wafers to stick together and difficulties in handling stacks of spacers using robotic actuators.
Innovation Solution
A robotic actuator with multiple suction cups configured to grasp both silicon wafers and rings, capable of rotating to face vertically, alternately manipulates and stacks these components, and includes a method to distinguish between wafers and rings, enabling automated handling and packaging in a horizontal wafer shipper.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If multiple robotic actuators are used to handle silicon wafers and rings separately, then the packaging process can be automated, but the device complexity increases
Solution Approach 1:
The patent combines wafer handling and ring handling capabilities into a single robotic actuator. The actuator includes a first surface with wafer suction cups for grasping silicon wafers and a second surface with ring suction cups for grasping rings, eliminating the need for multiple separate robotic actuators and reducing system complexity while maintaining full automation
Solution Approach 2:
The robotic actuator is designed as a multi-functional device that can perform multiple operations: it can grasp silicon wafers using the first surface, grasp rings using the second surface, and rotate about a flip axis to alternate between orientations. This universal design allows one actuator to replace what would traditionally require multiple specialized actuators
2Device complexity
If a single robotic actuator handles both wafers and rings, then device complexity is reduced, but the actuator must perform multiple functions increasing operational complexity
Solution Approach 1:
The actuator is segmented into distinct functional surfaces: a first surface with wafer suction cups dedicated to wafer handling, and a second surface with ring suction cups dedicated to ring handling. This segmentation allows each surface to be optimized for its specific function while being integrated into a single actuator, simplifying control logic by associating specific suction cup arrays with specific object types
Solution Approach 2:
The actuator incorporates dynamic reconfiguration through rotation about a flip axis, allowing the actuator to alternate between presenting the first surface (for wafer handling) and the second surface (for ring handling). This dynamic orientation change enables a single actuator to sequentially perform different functions without requiring complex multi-gripper mechanisms
3Productivity
If wafers are stacked alternately with rings, then packaging efficiency is improved, but adhesive forces cause wafers to stick together making handling difficult
Solution Approach 1:
The actuator serves as an intermediary handling device that introduces controlled separation between wafers and rings during the stacking process. By using vacuum suction through dedicated suction cups on different surfaces, the actuator mediates the interaction between wafers and rings, preventing unwanted adhesion while maintaining the alternating stack configuration for efficient packaging
4Productivity
If manual intervention is used for wafer handling, then handling precision is maintained, but productivity decreases
Solution Approach 1:
The patent replaces manual mechanical handling with an automated vacuum-based suction system. The wafer suction cups and ring suction cups use vacuum pressure to grasp and manipulate wafers and rings with precision, eliminating the need for manual intervention while maintaining handling accuracy through controlled vacuum application and release
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fully automated handling and packaging of silicon wafers and rings, achieving efficient stacking and unpacking with reduced manual intervention, ensuring cleanliness and safety, and capable of processing over 200 wafers per hour.
Implementation Method 1
a first surface with multiple attached wafer suction cups, and a second surface with multiple attached ring suction cups. The wafer suction cups are configured to collectively grasp a silicon wafer. The ring suction cups are configured to grasp a ring.
Data Source
AI summary
Systems and methods to manipulate stacks of silicon wafers and rings are described. In one aspect, a robotic actuator includes a robotic end effector that further a first surface having multiple attached wafer suction cups arranged to collectively grasp a silicon wafer. The robotic end effector also includes a second surface that further includes multiple attached ring suction cups arranged to collectively grasp a ring. The second surface also includes a bulk grabber positionable to grasp a collective stack of rings. The robotic actuator also includes an axial actuator configured to rotate the robotic end effector about a flip axis, such that either the first surface or the second surface faces vertically upwards.