Rotating Electrical Connector for Vacuum Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in stabilizing the rotation of sub-disks and ensuring uniformity during semiconductor manufacturing, as well as in providing a stable high DC voltage to electrostatic chucks without parasitic discharge in vacuum environments.
Innovation Solution
A substrate processing apparatus with a disk having periodically disposed electrostatic chucks, a power distribution unit, and a rotating electrical connector that includes an insulating barrier to prevent parasitic discharge, allowing for stable high voltage transmission and controlled rotation ratios, utilizing magnetic gears for rotational motion and snap ring power distribution for efficient electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an additional apparatus for injecting air or gas is used to rotate the second disk, then the second disk can be rotated about its axis, but foreign substances contained in the air or gas may be adsorbed to the substrate to cause product defects
Solution Approach 1:
The patent replaces the mechanical/gas-driven rotation system with a magnetic field-based rotation system. Magnets are disposed on the second disk to interact with a magnetic field generated by a magnetic drive mechanism, enabling rotation without direct mechanical contact or gas injection. This eliminates the source of foreign substance contamination while maintaining rotational capability.
2Ease of operation
If a conventional slipring is used to transmit high voltage to the rotating electrostatic chuck, then electrical connection is provided, but parasitic discharge occurs in vacuum environment
Solution Approach 1:
The patent introduces an insulating barrier as an intermediary component between the slipring and the electrostatic chuck. This insulating barrier prevents direct electrical contact that would cause parasitic discharge in the vacuum environment, while still allowing the high voltage to be transmitted to the electrostatic chuck through controlled insulation.
3Manufacturing precision
If the first disk rotates and the second disk rotates and revolves, then substrate processing uniformity is improved, but stable rotation control and fixing against centrifugal force become challenging
Solution Approach 1:
The patent employs a fixing mechanism that counteracts centrifugal force generated during rotation. The substrate fixing structure includes components designed to provide counterbalancing forces or mechanical constraints that prevent substrate displacement due to centrifugal effects, ensuring stable substrate positioning during complex rotational motion.
Solution Approach 2:
The patent implements a control system that monitors the rotation status of the first and second disks and adjusts their rotational parameters accordingly. This feedback mechanism ensures stable rotation control by detecting deviations from desired rotational characteristics and making real-time corrections to maintain process uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable substrate processing with uniformity and high DC voltage supply to electrostatic chucks, preventing parasitic discharge and enhancing substrate adsorption force, thus improving process uniformity and etching rates.
Implementation Method 1
an intermediate insulating barrier (373) disposed between the upper conductive ring (351a) and the lower conductive ring (351b). The intermediate insulating barrier (373) blocks generation of plasma between the upper conductive ring (351a) and the lower conductive ring (351b).
Implementation Method 2
a disk (124) including a plurality of electrostatic chucks (170) periodically disposed at a constant radius from a central axis
Data Source
AI summary
A substrate processing apparatus includes: a disk including a plurality of electrostatic chucks periodically disposed at a constant radius from a central axis; a disk support supporting the disk; a DC line electrically connected to the plurality of electrostatic chucks through the disk support; and a power supply configured to supply power to the DC line. The DC line includes: a first DC line penetrating through the disk support from the power supply; a power distribution unit configured to distribute the first DC line to connect the first DC line to each of the plurality of electrostatic chucks; and a plurality of second DC lines respectively connected to the plurality of electrostatic chucks in the power distribution unit.