Rotating Heat Dissipation Mechanism for Tool-Free Assembly
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Solution Overview
Problem
Conventional heat dissipating mechanisms have complex assembly and disassembly processes, often damaging components and requiring external tools, resulting in low efficiency and high risk of damage.
Innovation Solution
A heat dissipating mechanism featuring a rotation component and a heat dissipation component with a contacting surface, fin body, and guiding portion, allowing for quick assembly and disassembly without external tools by rotating the heat dissipation component relative to the circuit board, with supporting and pushing portions to secure the heat generation component at specific angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a screw or bolt is used to lock the heat conduction component with the slot structure, then the heat dissipation effectiveness is improved, but the assembly process becomes complicated and time-consuming
Solution Approach 1:
The patent removes the screw or bolt fixing components from the heat dissipation structure, extracting the fastening function and replacing it with a snap-fit mechanism where the heat conduction component is directly locked into the slot structure through elastic deformation of the slot walls, eliminating the need for external fasteners
Solution Approach 2:
The slot structure performs self-fixing through elastic deformation of its walls when the heat conduction component is inserted, automatically locking without requiring external tools or additional fastening components, making the assembly process tool-free and simplified
2Reliability
If a screwdriver or external tool is used to fix or detach the heat conduction component, then the fixing reliability is improved, but the operation convenience deteriorates and component damage risk increases
Solution Approach 1:
The heat conduction component and slot structure form a self-locking mechanism where the elastic walls of the slot automatically grip the component upon insertion, and can be easily released by applying opposite force, eliminating the need for external tools while maintaining secure fixing
Solution Approach 2:
The slot structure utilizes elastic deformation dynamics, where the walls flex during insertion to allow the heat conduction component to pass through, then return to their original shape to create a locking effect, enabling tool-free assembly and disassembly
3Strength
If a screw or bolt is used to fix the heat conduction component, then the fixing strength is improved, but the component damage risk increases due to external tools
Solution Approach 1:
The patent eliminates screws, bolts, and external fixing tools from the assembly, removing the source of potential component damage while maintaining adequate fixing strength through the elastic snap-fit mechanism between the slot structure and heat conduction component
Solution Approach 2:
The slot structure's elastic walls provide a gentle yet effective locking force that secures the heat conduction component without the need for aggressive fastening, thereby reducing the risk of damaging sensitive electronic components during assembly and disassembly
4Stability of the object's composition
If a conventional fixing method with screws or bolts is used, then the structural stability is improved, but the assembly and disassembly efficiency deteriorates
Solution Approach 1:
The slot structure automatically locks the heat conduction component through elastic deformation of its walls, providing structural stability without requiring manual fastening operations, enabling rapid assembly and disassembly while maintaining secure structural connection
Solution Approach 2:
The elastic walls of the slot structure dynamically adapt during assembly, flexing to allow insertion then returning to their original shape to create a stable locked state, enabling both structural stability and rapid assembly/disassembly efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and tool-free operation with reduced risk of component damage, enhancing assembly and disassembly efficiency while maintaining effective heat dissipation.
Implementation Method 1
The heat dissipation component is configured to contact against the heat generation component and dissipate heat generated by the heat generation component
Implementation Method 2
The heat dissipation component is rotatably disposed on the rotation component
Data Source
AI summary
A heat dissipating mechanism is used to dissipate heat generated by a heat generation component of an electronic device. The heat generation component is disposed on a circuit board. The heat dissipating mechanism includes a rotation component and a heat dissipation component. The rotation component is disposed on the circuit board. The heat dissipation component is rotatably disposed on the rotation component. The heat dissipation component includes a contacting surface and a fin body. The contacting surface is a bottom surface of the fin body and configured to contact against the heat generation component.