Rotating Heat Sink Assembly for Electronic Device Cooling
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Solution Overview
Problem
The complexity of deploying electronic components and heat dissipators increases when the installation mode of electronic components is adjusted, leading to inconvenience due to the need for simultaneous adjustments in the heat dissipator, which complicates the heat dissipation process.
Innovation Solution
A heat dissipation apparatus with an adjustable heat dissipation component, a fixed substrate, a rotating shaft, and a connecting component allows the electronic component to be rotated together with the heat dissipation component, reducing deployment complexity while maintaining effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the installation mode of the electronic component is adjusted to expand radiation range, then the radiation range is improved, but the deployment complexity of the heat dissipator increases
Solution Approach 1:
The patent combines the electronic component and heat dissipator into a single integrated assembly that rotates together as one unit. The connecting component couples the electronic component to the heat dissipator, ensuring they move simultaneously when the rotating shaft is actuated. This merging eliminates the need for separate adjustment operations, reducing deployment complexity while maintaining the expanded radiation range capability.
Solution Approach 2:
The rotating assembly serves multiple functions: it positions the electronic component for optimal radiation range and simultaneously positions the heat dissipator for effective heat dissipation. This multi-functional design allows a single adjustment mechanism to accomplish what would otherwise require multiple independent adjustments, simplifying the overall deployment process.
2Reliability
If the electronic component is fixedly connected to the heat dissipator, then the heat dissipation effect is maintained, but the flexibility in adjusting installation mode is reduced
Solution Approach 1:
The patent transforms the static fixed connection into a dynamic adjustable connection through the rotating shaft mechanism. The connecting component maintains reliable thermal contact between the electronic component and heat dissipator while allowing the entire assembly to rotate to different angles. This dynamic design enables both reliable heat dissipation and flexible installation mode adjustment.
Solution Approach 2:
The rotating shaft acts as an intermediary mechanism between the fixed mounting structure and the adjustable heat dissipator-electronic component assembly. It mediates between the need for stable heat dissipation connection and the need for installation flexibility, allowing angular adjustment while maintaining the functional relationship between components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the operation of electronic devices by allowing angle adjustments of the heat dissipation apparatus without affecting heat dissipation performance, enhancing convenience and flexibility.
Implementation Method 1
a heat dissipator is usually fixed onto a surface of the electronic component, and a fin on the heat dissipator is used to dissipate the heat outwards, to reduce the temperature of the electronic component
Implementation Method 2
a heat dissipator is usually fixed onto a surface of the electronic component
Implementation Method 3
The rotating shaft is also referred to as a mechanical shaft, and performs connection and rotation functions
Data Source
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AI summary
A heat dissipation apparatus is provided, including an adjustable heat dissipation component (10), a fixed substrate (201), a rotating shaft (30), and a connecting component (40), where an electronic component (50) is disposed on one side of the adjustable heat dissipation component (10), and the rotating shaft (30) is disposed on another side of the adjustable heat dissipation component (10); and one end of the connecting component (40) is connected to the adjustable heat dissipation component (10), another end of the connecting component (40) is connected to the fixed substrate (201), and the connecting component (40) drives the adjustable heat dissipation component (10) to rotate by using the rotating shaft (30). A heat dissipator, an electronic device, and a heat dissipation control method are provided, where the connecting component (40) may be adjusted to rotate the electronic component (50) together with the adjustable heat dissipation component (10), to reduce complexity in deploying the electronic component and the heat dissipation apparatus without affecting a heat dissipation effect, thereby improving convenience of operation.