Rotating Ion Beam Blocking Component for Particle Collection
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Solution Overview
Problem
Conventional ion implantation methods suffer from contamination in the ion beam path and wafer due to particles peeling off from the Faraday flag's restriction plate, leading to reduced product yield and frequent component replacements.
Innovation Solution
An ion beam blocking component with a front plate, back plate, and side plates featuring grooves on both surfaces to collect particles, integrated into a polyhedron or roulette-shaped device that rotates to maintain ion beam blocking, preventing contamination and extending component life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a sheet-like restriction plate is used to block ion beam, then ion beam blocking function is achieved, but particles impinge on the plate and contaminate the traveling path and chamber, degrading product yield
Solution Approach 1:
The restriction plate is divided into multiple segments arranged radially around the ion beam path. Each segment can be independently positioned to block the ion beam when needed, while the gaps between segments allow particles to fall into recesses rather than contaminating the chamber. This segmentation resolves the contradiction by maintaining blocking effectiveness while reducing contamination.
Solution Approach 2:
The invention converts the harmful peeling particles into a beneficial feature by designing recesses that collect these particles. The particles that would otherwise contaminate the chamber are now captured in the recesses, transforming the harmful contamination effect into a controlled collection mechanism that protects the product yield.
2Object-affected harmful factors
If ion beam blocking component is frequently replaced to maintain cleanliness, then contamination is reduced, but manufacturing time and operational efficiency decrease
Solution Approach 1:
The restriction plate is designed with recesses that preliminarily collect particles before they can contaminate the chamber. This preliminary action of particle collection prevents contamination accumulation, extending the operational life of the blocking component and reducing the frequency of replacements needed.
Solution Approach 2:
The design allows particles to be discarded into the recesses rather than accumulating on the blocking surface. This discarding mechanism into controlled recesses maintains the blocking effectiveness while preventing contamination, reducing the need for frequent component replacement and saving operational time.
3Object-affected harmful factors
If larger blocking component is used to prevent particle peeling, then contamination is reduced, but device complexity and space requirements increase
Solution Approach 1:
The invention adds a vertical dimension to the blocking component design by incorporating recesses that extend downward from the blocking surface. This dimensional change allows particle collection without increasing the horizontal footprint or overall complexity of the component, resolving the contradiction between contamination prevention and device simplicity.
Solution Approach 2:
The recesses are nested within the blocking component structure itself, creating a compact design where particle collection features are integrated into the blocking component rather than requiring separate external systems. This nesting approach prevents contamination without increasing device complexity or space requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces contamination in the ion beam path, improves product yield, and saves time by rotating ion beam blocking components, thereby preventing the peeling phenomenon and extending the service life of ion beam blocking components.
Implementation Method 1
An ion beam is generated by an ion source of the ion implanter
Implementation Method 2
the impurities are dissociated into ions firstly, and after acceleration and selection, specific ions are directly impinged into the host material
Implementation Method 3
particles generated during or after conducting the step of generating the ion beam
Data Source
AI summary
A method of performing an ion implantation is provided. A workpiece is installed in the ion implanter. A wafer is provided in a receiving space within an ion implanter. An ion beam is generated by an ion source of the ion implanter. The bombard of the ion beam is blocked and particles generated during or after conducting the step of generating the ion beam are collected by the workpiece.


