Rotating Multi-Beam Laser Processing for Uniform Wafer Thickness
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Solution Overview
Problem
Existing surface processing machines for wafers, such as grinding machines, often result in non-uniform thickness due to wear and mechanical rigidity issues, leading to reduced flexural strength and the formation of arcuate grinding marks.
Innovation Solution
A surface processing machine equipped with a chuck table, a processing unit that includes a laser oscillator, condenser, collimation lens, beam intensity adjuster, and rotating mechanism, which applies ablation processing to the wafer surface, allowing for precise thickness control and uniform processing without relying on the clearance between the chuck table and grinding stones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If grinding stones are used to process the wafer surface, then the wafer can be ground to desired thickness, but arcuate grinding marks are formed and flexural strength is reduced
Solution Approach 1:
The patent replaces the mechanical grinding system with a laser processing system. The laser beam processes the wafer surface through optical energy rather than mechanical contact, eliminating the grinding marks and associated strength reduction while maintaining thickness control capability
Solution Approach 2:
The patent changes the processing parameter from mechanical force to laser energy parameters. By controlling laser power, pulse duration, and scanning speed, the system achieves precise thickness control without the mechanical contact that causes grinding marks and strength degradation
2Manufacturing precision
If clearance between chuck table and grinding stones is used to control finish thickness, then processing can be performed, but non-uniform thickness results due to wear and mechanical rigidity issues
Solution Approach 1:
The patent eliminates the mechanical clearance-based thickness control system and replaces it with laser processing. The laser beam can precisely control material removal without relying on mechanical clearance, thereby achieving uniform thickness independent of mechanical wear and rigidity variations
Solution Approach 2:
The laser processing system inherently maintains consistent processing conditions through optical path stability and programmable motion control, eliminating the need for mechanical clearance maintenance and providing self-consistent thickness control throughout the processing operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables uniform thickness processing of wafers without reducing flexural strength, avoiding arcuate grinding marks and ensuring consistent thickness across the wafer surface.
Implementation Method 1
a laser oscillator that emits a laser beam, a condenser that forms the laser beam which has been emitted by the laser oscillator, into a plurality of laser beams... configured to apply ablation processing to the surface of the workpiece
Implementation Method 2
a collimation lens that is arranged between the laser oscillator and the condenser and collimates the laser beam into parallel light
Implementation Method 3
a rotating mechanism that rotates the condenser
Data Source
AI summary
A surface processing machine for processing a surface of a workpiece has a processing unit which includes a laser oscillator that emits a laser beam, a condenser that forms the laser beam which has been emitted by the laser oscillator, into a plurality of beams, a collimation lens that is arranged between the laser oscillator and the condenser and collimates the laser beam into parallel light, a beam intensity adjuster that is arranged between the condenser and the collimation lens and adjusts an intensity of the beams, and a rotating mechanism that rotates the condenser.