Rotating LiDAR Assembly With Optical Data Link and Compact Alignment
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Solution Overview
Problem
Current LIDAR systems for autonomous vehicles are technologically complex and costly, with architectures that are difficult to manufacture and calibrate, leading to high production costs and reduced reliability, especially when scaling for higher resolution, due to complex alignment requirements and lack of system integration.
Innovation Solution
A compact LIDAR system design featuring a spinning light ranging device connected to upper and lower circuit board assemblies that cooperate for power and data transmission via wireless elements, eliminating the need for external physical connections and incorporating integrated stator and rotor elements for electromagnetic drive, and an optical communication subsystem for efficient data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate laser emitter/detector pairs are mounted on individual separate circuit boards, then the field of view of each detector can overlap with the field of view of its respective emitter, but the manufacturing complexity and cost increase exponentially
Solution Approach 1:
The patent combines multiple laser emitter/detector pairs and their associated circuitry onto a single integrated circuit board, eliminating the need for separate boards for each emitter/detector pair. This integration maintains the required field of view overlap while dramatically reducing manufacturing complexity and assembly steps.
Solution Approach 2:
The unified circuit board serves multiple functions simultaneously: it provides structural support, electrical connections for multiple emitters and detectors, alignment references, and mounting surfaces. This multi-functional design replaces what would otherwise require multiple separate components and assembly operations.
2Measurement precision
If more laser emitter/detector pairs are added to increase resolution, then the resolution improves, but the manufacturing cost and complexity increase exponentially
Solution Approach 1:
The patent integrates multiple laser emitter/detector pairs onto a single circuit board, allowing resolution to be increased by adding more pairs without proportionally increasing manufacturing complexity. The shared board infrastructure means that each additional emitter/detector pair adds minimal incremental complexity compared to implementing them on separate boards.
Solution Approach 2:
The circuit board is designed with modular segments or zones for different emitter/detector pairs, allowing for systematic expansion. Each pair can be independently configured and tested while sharing common infrastructure, enabling scalable resolution improvement without exponential complexity growth.
3Manufacturing precision
If precision alignment techniques are used during assembly, then the field of view overlap is ensured, but the assembly time and cost increase
Solution Approach 1:
The circuit board is pre-designed with built-in alignment features, mechanical references, and positioning structures that ensure correct emitter/detector alignment during manufacturing. This preliminary incorporation of alignment mechanisms eliminates the need for time-consuming post-assembly alignment procedures and enables faster, more consistent assembly.
Solution Approach 2:
The integrated circuit board design provides self-aligning features where components naturally position themselves during assembly through mechanical constraints, keyed mounting structures, or self-centering mechanisms. This self-service alignment capability reduces or eliminates the need for external alignment tools and procedures.
4Volume of moving object
If a compact design is implemented, then the system size is reduced, but the integration of wireless power and data transmission components becomes more challenging
Solution Approach 1:
The patent integrates wireless power transmission and optical data communication components directly onto the same circuit board that houses the laser emitters and detectors. This consolidation of multiple subsystems into a single integrated platform achieves compact size while managing complexity through unified board-level integration rather than separate modules.
Solution Approach 2:
The circuit board is designed as a multi-functional platform that simultaneously supports laser emission, detection, wireless power reception, and optical data transmission. This universal design allows all these functions to coexist in a compact form factor by sharing common infrastructure such as the board substrate, mounting structures, and spatial arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables cost-effective, reliable, and compact LIDAR systems suitable for mass-market adoption, simplifying assembly and reducing manufacturing complexity while maintaining high performance and scalability.
Implementation Method 1
a stator driver circuit disposed on either the second or the first circuit board assemblies and configured to provide a drive signal to the plurality of stator elements, thereby imparting an electromagnetic force on the plurality of rotor elements to drive a rotation of the second circuit board assembly about the shaft
Data Source
AI summary
A light ranging system including a shaft having a longitudinal axis; a light ranging device configured to rotate about the longitudinal axis of the shaft, the light ranging device including a light source configured to transmit light pulses to objects in a surrounding environment, and detector circuitry configured to detect reflected portions of the light pulses that are reflected from the objects in the surrounding environment and to compute ranging data based on the reflected portion of the light pulses; a base subsystem that does not rotate about the shaft; and an optical communications subsystem configured to provide an optical communications channel between the base subsystem and the light ranging device, the optical communications subsystem including one or more turret optical communication components connected to the detector circuitry and one or more base optical communication components connected to the base subsystem.