Rotating Manifold Bonder for Variable Pitch Substrate Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process for disposable absorbent articles, such as diapers, is inefficient as it requires switching equipment or making significant modifications to produce different sizes, which is costly and time-consuming.
Innovation Solution
A bonder apparatus with rotating manifolds and a system for heating fluid to partially melt substrate layers, allowing for the bonding of substrates of varying sizes on the same equipment by controlling the release of heated fluid through apertures and applying pressure to create discrete bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If equipment is switched or significantly modified to produce different sizes of absorbent articles, then manufacturing capability for different sizes is improved, but production cost and time increase
Solution Approach 1:
The bonder apparatus incorporates a rotatable manifold system that can dynamically reposition heating zones and fluid delivery apertures to accommodate different substrate sizes. The manifold rotates to bring different aperture patterns into position, allowing the same equipment to bond different sized absorbent articles without physical reconfiguration, thus resolving the contradiction between adaptability and production time.
Solution Approach 2:
The system changes operational parameters by controlling the rotation speed, fluid pressure, and heating intensity to match different substrate sizes. By adjusting these parameters rather than modifying the physical equipment, the system achieves versatility for different product sizes while maintaining consistent production speed and minimizing downtime.
2Adaptability or versatility
If equipment is switched or significantly modified to produce different sizes of absorbent articles, then manufacturing capability for different sizes is improved, but production cost increases
Solution Approach 1:
The bonder apparatus is designed with a universal manifold system that serves multiple functions by rotating to different positions. The same manifold structure handles bonding for various absorbent article sizes, eliminating the need for separate equipment for different product lines. This multi-functionality reduces capital expenditure on equipment diversity and lowers overall production costs while maintaining the ability to manufacture different sized products.
3Manufacturing precision
If heated fluid is released through apertures to partially melt substrate layers, then bonding precision is improved, but control complexity increases
Solution Approach 1:
The manifold is divided into multiple segments with individual aperture patterns that can be independently controlled. Each segment corresponds to a specific bonding zone and can be activated or adjusted independently based on the substrate size and bonding requirements. This segmentation allows precise control over heating and bonding in different zones without requiring complex centralized control systems, thus achieving bonding precision while managing control complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient production of absorbent articles of different sizes on the same equipment, reducing production costs and time by allowing for precise bonding of substrates without the need for extensive modifications.
Implementation Method 1
a heat member configured to heat a fluid to a temperature sufficient to at least partially melt the substrate assembly
Implementation Method 2
The heated fluid may then be released through a plurality of apertures in the nozzle plate to at least partially melt the substrate assembly
Implementation Method 3
A pressure member configured to apply pressure to the substrate assembly at a location corresponding to the overlap area
Data Source
AI summary
A substrate assembly is mechanically deformed to form various products. In part, the substrate assembly may advance toward a bonder apparatus. The bonder apparatus rotates about a longitudinal axis and includes a plurality of manifolds. The plurality of manifolds allow for substrate assemblies including different process product pitches to be processed on a single bonder apparatus.