Rotating Nozzle Buffer for High-Temperature Chemical Discharge
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Solution Overview
Problem
Existing liquid supply apparatuses in semiconductor manufacturing face challenges with heat-resistant limitations, leading to damage from high-temperature chemicals and inefficient chemical distribution, which affects process performance and increases chemical usage.
Innovation Solution
A substrate treating apparatus with a liquid supply unit featuring a nozzle member and driving member that includes a buffer space with a discharge port, allowing controlled temperature adjustment and vapor pressure management, using a heating member and exhaust member to efficiently supply and discharge treating liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a chemical is heated to high temperature for substrate cleaning, then cleaning effectiveness is improved, but the chemical causes damage to resin components such as filters, pumps, and valves in the liquid supply apparatus
Solution Approach 1:
The liquid supply apparatus is divided into two separate systems: a heating system that handles high-temperature chemicals and a liquid supply system that handles liquid delivery. The heating system includes a heating chamber and heating member, while the liquid supply system includes a pump and valve. This segmentation allows each system to operate within its safe temperature range, preventing heat damage to the pump and valve components.
Solution Approach 2:
A heat-resistant container or transfer mechanism acts as an intermediary between the heating system and the liquid supply system. This intermediary holds the heated chemical temporarily and transfers it to the liquid supply apparatus without exposing the pump and valve to high temperatures, thus protecting these components while enabling effective cleaning.
2Temperature
If indirect heating method is used to heat the substrate, then the substrate is heated, but the chemical is not discharged onto the substrate in a high-temperature state, degrading process performance
Solution Approach 1:
The chemical is heated to high temperature in advance within the heating chamber before being discharged onto the substrate. This preliminary heating action ensures that the chemical reaches the substrate in a high-temperature state, maintaining effective cleaning performance while the substrate heating occurs simultaneously through direct contact.
3Temperature
If indirect heating method is used, then the substrate is heated, but the amount of chemical supplied onto the substrate increases
Solution Approach 1:
The system incorporates temperature sensing and control mechanisms that monitor the chemical temperature and adjust the heating power accordingly. This feedback control ensures the chemical reaches and maintains the optimal temperature for effective cleaning while minimizing excessive chemical supply. The pump and valve can also adjust flow rates based on temperature conditions, preventing over-supply of chemical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently supplies treating liquids at target temperatures, controlling temperature and vapor pressure, thereby preventing damage and optimizing chemical usage.
Implementation Method 1
a heating member configured to heat the treating liquid filled in the buffer space
Implementation Method 2
a rotation member for changing the body between a first state and a second state by a rotation, and wherein the first state is a state at which a treating liquid filled in the buffer space is maintained so the treating liquid does not flow to the discharge port, and the second state is a state at which the treating liquid filled in the buffer space is discharged to an outside of the body through the discharge port
Data Source
AI summary
The substrate treating apparatus includes a liquid supply unit for supplying a treating liquid to a substrate supported by a support unit, the liquid supply unit includes a nozzle member for discharging the treating liquid; and a driving member for moving the nozzle member to a standby position and a process position, the nozzle member includes a body having a buffer space and a discharge port configured to discharge the treating liquid; and a rotation member for changing the body between a first state and a second state by a rotation, the first state is a state at which a treating liquid filled in the buffer space is maintained so the treating liquid does not flow to the discharge port, and the second state is a state at which the treating liquid filled in the buffer space is discharged to an outside of the body through the discharge port.