Rotating Nozzle Attachment for IC Chip Mounting Yield
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Solution Overview
Problem
The existing IC chip mounting processes for RFID inlays require a dedicated backup apparatus, which increases costs and occupies space, and there is a need to improve production yield without additional apparatuses.
Innovation Solution
An IC chip mounting apparatus with an ejection unit, movable nozzles, a rotating unit, and a controller that ensures accurate placement of IC chips on antennas without a dedicated backup apparatus, by ejecting adhesive onto reference positions and using image capture devices to determine and correct the placement of IC chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dedicated backup apparatus is provided for mounting IC chips on antennas, then production yield is improved, but device complexity and cost increase
Solution Approach 1:
The mounting apparatus is designed to perform multiple functions: it can mount IC chips on normal antennas and also serve as a backup for re-mounting chips on antennas that were previously missed or failed. The determination unit identifies which antennas need backup mounting, and the apparatus dynamically adjusts its operation to handle both normal and backup mounting tasks using the same hardware, eliminating the need for a separate dedicated backup apparatus.
Solution Approach 2:
The system performs self-inspection and self-correction by using the determination unit to identify mounting failures and automatically initiating backup mounting operations. The apparatus monitors its own performance in real-time and autonomously decides when to perform additional mounting operations, making the production process self-correcting without external intervention or additional specialized equipment.
2Reliability
If a dedicated backup apparatus is provided for mounting IC chips, then production yield is improved, but space occupation increases
Solution Approach 1:
The same mounting apparatus is used for both normal IC chip mounting and backup mounting operations. The apparatus dynamically switches between these functions based on real-time determination of which antennas require backup mounting, thereby eliminating the need for a separate dedicated backup apparatus and reducing the total space required for the manufacturing line.
3Productivity
If multiple nozzles are used for mounting IC chips, then productivity is improved, but manufacturing precision may deteriorate due to synchronization issues
Solution Approach 1:
The rotational speed of the nozzle attachment is made dynamically adjustable based on real-time feedback from the determination unit. When a non-sucking nozzle is detected, the rotational speed is modified to ensure that a subsequent nozzle arrives at the correct position and time to perform backup mounting, thereby maintaining placement accuracy despite using multiple nozzles and dynamic operational adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves production yield by enabling precise and efficient placement of IC chips on RFID inlays without the need for additional apparatuses, enhancing manufacturing efficiency and reducing costs.
Implementation Method 1
each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna
Data Source
AI summary
The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.