Rotating Nozzle Apparatus for Semiconductor Substrate Treatment
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Solution Overview
Problem
In semiconductor manufacturing, the photo lithography process faces challenges in achieving precise pattern creation on substrates due to the limited hitting force and shapeability of chemical liquids used in the developing process, particularly when using a diagonal discharge method.
Innovation Solution
A nozzle apparatus that combines vertical and diagonal discharge methods through a slot discharge port, with a rotating nozzle tip and control unit to enhance the hitting force and shapeability of the chemical liquid, allowing for improved wetting and separation of particles and residues on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a diagonal discharge method is used to spray chemical liquid onto the substrate, then the chemical liquid can be applied to the substrate surface, but the hitting force and shapeability of the chemical liquid are weakened
Solution Approach 1:
The nozzle body is configured to rotate during the spraying process, dynamically changing the discharge direction from a fixed diagonal orientation to a rotating pattern that includes vertical discharge components. This dynamic adjustment allows the chemical liquid to be sprayed with greater hitting force while maintaining operational flexibility through programmable rotation patterns.
Solution Approach 2:
The discharge port is designed with a specific inclination angle relative to the substrate surface, and the nozzle body rotation angle is controlled to vary during spraying. By changing these parameters - the fixed port inclination and the dynamic body rotation - the system achieves both strong hitting force during vertical discharge phases and maintains ease of operation through controlled parameter variation.
2Force
If a vertical discharge method is used to spray chemical liquid onto the substrate, then the hitting force is increased, but the shapeability and wetting effect are reduced
Solution Approach 1:
The nozzle body rotates periodically during the spraying process, creating alternating phases of vertical discharge (for hitting force) and diagonal discharge (for shapeability and wetting). This periodic action between different discharge orientations allows the system to achieve both strong particle separation during vertical phases and good pattern formation during diagonal phases.
Solution Approach 2:
The system dynamically adjusts the nozzle orientation during spraying, transitioning between vertical and diagonal discharge modes through controlled rotation. This dynamic approach allows the chemical liquid to deliver strong hitting force when vertically oriented while maintaining shapeability through diagonal discharge phases, resolving the contradiction between these two requirements.
3Manufacturing precision
If a fixed nozzle orientation is used, then the discharge method is simple, but the separation effect of particles and residues is insufficient
Solution Approach 1:
The nozzle body is configured to rotate during the spraying process, dynamically changing the discharge direction from a fixed diagonal orientation to a rotating pattern that includes vertical discharge components. This dynamic adjustment allows the chemical liquid to be sprayed with greater hitting force while maintaining operational flexibility through programmable rotation patterns.
Solution Approach 2:
The discharge port is designed with a specific inclination angle relative to the substrate surface, and the nozzle body rotation angle is controlled to vary during spraying. By changing these parameters - the fixed port inclination and the dynamic body rotation - the system achieves both strong hitting force during vertical discharge phases and maintains ease of operation through controlled parameter variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combined discharge method increases the hitting force and shapeability of the chemical liquid, enhancing the separation effect and puddle formation for high-precision development in the photo lithography process.
Implementation Method 1
a rotating member for rotating the nozzle body or the nozzle tip so that a treatment fluid is rotationally sprayed onto the substrate
Implementation Method 2
the discharge port may have a slip shape and may be provided to spray the treatment fluid at a predetermined angle inclined to the substrate surface
Implementation Method 3
the substrate is wetted by the chemical liquid sprayed from the nozzle
Data Source
AI summary
A nozzle apparatus may comprise a nozzle body having a nozzle tip with a discharge port for spraying a treatment fluid onto a substrate; a nozzle moving member for moving the nozzle body relative to the substrate; a rotating member for rotating the nozzle body or the nozzle tip so that a treatment fluid is sprayed onto the substrate during rotation; and a control unit configured to control an operation of the nozzle moving member and the rotating member.