Plating Electrode With Rotating Impregnated Fabric for Selective Surface Plating

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Solution Overview

Problem

The partial plating method disclosed in Patent Literature 1 is unable to selectively form a plating film only on the surface of the object to be plated, as the entire plating target portion is immersed in the plating solution, leading to plating on the entire periphery of the immersed portion, thus limiting the target portion for partial plating and preventing the formation of various patterns.

Innovation Solution

A plating electrode with a plating-solution-impregnated fabric in an annular shape, an annular part with conductivity, and rotary parts that rotate synchronously to ensure contact and sliding of the plating-solution-impregnated fabric only on the designated surface of the object to be plated, eliminating the need for masking work and allowing selective surface plating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the entire plating target portion is immersed in the plating solution, then plating treatment can be applied to the object, but plating occurs on the entire periphery of the immersed portion making selective plating impossible

Engineering Contradiction:
Improveplating treatment applicabilityVSAvoidselective plating capability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The plating electrode is divided into a non-conductive support body and a conductive plating pattern layer that is segmented and positioned only at the target plating area. This segmentation allows the plating solution to contact only the intended portions of the object, enabling selective plating while maintaining ease of manufacture.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The conductive plating pattern is applied locally only to the specific areas where plating is desired, rather than covering the entire electrode surface. This local quality approach allows the electrode to provide plating treatment while simultaneously preventing plating on non-target areas, resolving the contradiction between manufacturability and selectivity.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If masking work is performed to protect non-plating portions, then selective plating can be achieved, but processing time increases reducing productivity

Engineering Contradiction:
Improveselective plating capabilityVSAvoidprocessing time
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The conductive plating pattern is pre-applied to the non-conductive support body before the plating process. This preliminary action creates a built-in mask that defines the plating areas in advance, eliminating the need for separate masking steps during production and thereby improving productivity while maintaining selective plating capability.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The non-conductive support body acts as an intermediary between the conductive plating pattern and the object to be plated. It provides structural support while allowing the conductive pattern to selectively conduct electricity only to desired areas, achieving selective plating without requiring additional masking materials or steps.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If a rigid electrode structure is used, then manufacturing precision can be maintained, but adaptability to different plating patterns is limited

Engineering Contradiction:
Improveplating pattern accuracyVSAvoidplating pattern variety
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The plating electrode uses a flexible or adaptable conductive plating pattern on a non-conductive support body, allowing the pattern to be modified or reconfigured for different plating designs. This dynamic approach enables high manufacturing precision for each specific pattern while providing versatility to accommodate various plating requirements.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables the formation of a plating film only on the intended surface of the object, eliminating the need for masking materials and enhancing productivity by allowing selective surface plating without unnecessary plating on non-target areas.

Implementation Method 1

transmitting an electric current through the plating-solution-impregnated fabric by use of the DC conversion power supply

Methodology Applied
Scientific EffectElectroplating: Electroplating

Implementation Method 2

causing the plating-solution-impregnated fabric to come into contact with and to slide against a portion to be plated of the object to be plated

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS20240200222A1Plating electrode and plating method that uses the plating electrode
Publication Date: 2024.06.20 MITSUBISHI ELECTRIC CORP
  • US20240200222A1 patent drawing
  • US20240200222A1 patent drawing
  • US20240200222A1 patent drawing

AI summary

A plating electrode includes a plating-solution-impregnated fabric, an annular part, a first rotary part, and a second rotary part. An anode of a DC conversion power supply is electrically connected to the first rotary part, and a cathode of the DC conversion power supply is electrically connected to an object to be plated. The annular part is caused to turn in synchronization with rotation of the first rotary part and the second rotary part to cause the plating-solution-impregnated fabric to turn in an annular direction, thereby causing the plating-solution-impregnated fabric to come into contact with and to slide against a portion to be plated of the object to be plated.