Rotating Radiative Heating for Uniform Wafer Temperature Sensing
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Solution Overview
Problem
Existing thermal processing devices in the semiconductor industry face challenges in uniformly heating workpieces and accurately measuring temperature without causing damage, particularly during rapid thermal processing.
Innovation Solution
A processing apparatus with rotatable radiative heating sources and dielectric windows that allow for uniform heat distribution and accurate temperature measurement by rotating the heating sources while keeping the workpiece stationary, using dielectric windows to shield sensors from stray radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If radiative heating sources are used to heat workpieces rapidly, then heating speed is improved, but temperature measurement accuracy deteriorates due to stray radiation interference
Solution Approach 1:
A dielectric window is introduced as an intermediary component between the radiative heating sources and the workpiece/support structure. This window selectively transmits heating radiation while blocking stray radiation from reaching temperature sensors, thereby resolving the interference problem that limits measurement accuracy during rapid thermal processing
Solution Approach 2:
The heating system is segmented into multiple independently controllable radiative heating sources positioned at different locations. This allows selective activation of specific heating zones and enables differential heating schemes, improving heating speed control while reducing overall stray radiation exposure to measurement systems
2Stability of the object's composition
If workpieces are heated uniformly across the surface, then temperature distribution is improved, but heating time increases reducing productivity
Solution Approach 1:
The system employs dynamically controllable radiative heating sources that can independently adjust their intensity and timing. This dynamic control enables rapid heating followed by immediate uniformization, achieving both speed and uniformity by adapting heating parameters in real-time during the thermal processing cycle
Solution Approach 2:
Different regions of the workpiece receive differentiated heating treatment through selectively activated radiative sources. Edge regions can be heated differently from center regions, allowing localized temperature control that achieves overall uniformity faster than uniform heating approaches
3Stability of the object's composition
If multiple heating sources are used on both sides of the workpiece, then heating uniformity is improved, but device complexity increases
Solution Approach 1:
The dielectric window serves multiple functions simultaneously: it acts as a radiation shield for temperature sensors, provides structural support for the workpiece, and maintains chamber integrity. This multi-functionality reduces the need for additional separate components, offsetting the complexity introduced by dual-sided heating sources
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures uniform heating and precise temperature control of workpieces, reducing damage and improving processing efficiency by rotating heating sources and using phase-locked emitters and sensors to minimize interference.
Implementation Method 1
one or more radiative heating sources disposed on the second side of the processing chamber, the one or more radiative heating sources configured to heat the workpiece from the back side of the workpiece
Implementation Method 2
one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources
Implementation Method 3
a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a temperature measurement indicative of a temperature of the back side of the workpiece
Data Source
AI summary
A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, a rotation system configured to rotate the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.