Rotating Screening Members for Compact Sputtering Apparatus

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Solution Overview

Problem

Conventional sputtering apparatuses require increased space for the screening mechanism to retract, which is not suitable for larger substrates, necessitating a more compact design.

Innovation Solution

A sputtering apparatus with a rotating mechanism that allows the screening members to move between a screening position and a retreat position, enabling compact retraction by rotating the first and second screening members about a common axis, with different angles of rotation to maintain screening coverage while minimizing space usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional screening mechanism is used to cover the substrate holder surface, then the substrate can be effectively screened during sputtering, but the apparatus size increases due to the space required for the screening mechanism to retract

Engineering Contradiction:
Improvescreening effectivenessVSAvoidapparatus size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The screening members are designed to rotate dynamically between a screening position (extending over the substrate mount surface) and a retracted position (withdrawn to minimize space). This dynamic configuration allows the apparatus to maintain effective screening during sputtering while reducing the space required when screening is not needed, thus resolving the contradiction between screening effectiveness and apparatus size.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

Instead of retracting the screening members linearly along the same dimension they occupy during screening, the invention rotates them about an axis perpendicular to the substrate mount surface. This dimensional change from linear extension to rotational retraction allows the screening members to be positioned out of the way in a different spatial dimension, minimizing the apparatus footprint while maintaining screening capability when needed.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the screening mechanism is designed to retract completely, then the apparatus size is reduced, but the screening coverage and deposition control are compromised

Engineering Contradiction:
Improveapparatus sizeVSAvoiddeposition control
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The screening members can be dynamically positioned at the screening position during deposition processes requiring precision control, and then retracted when screening is not needed. This dynamic adaptability ensures that deposition control and screening coverage are maintained when required, while apparatus size is minimized during non-deposition phases.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The screening members are periodically extended to the screening position during deposition operations and retracted during non-deposition operations. This periodic action ensures that precise screening coverage is available when needed for manufacturing precision, while the apparatus maintains a compact size during other operational phases.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The compact design allows for efficient use of space, preventing the apparatus from increasing in size, while maintaining effective screening and deposition capabilities.

Implementation Method 1

a rotating mechanism configured to rotate the first screening member and the second screening member, wherein the first screening member and the second screening member are configured to be rotated by the rotating mechanism

Methodology Applied
Scientific EffectRotational motion:

Implementation Method 2

a sputtering apparatus used in a semiconductor manufacturing process

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentUS8652309B2Sputtering apparatus and electronic device manufacturing method
Publication Date: 2014.02.18 CANON ANELVA CORP
  • US8652309B2 patent drawing
  • US8652309B2 patent drawing
  • US8652309B2 patent drawing

AI summary

A sputtering apparatus comprises a substrate holder, and a screening member configured to screen a substrate mount surface of a surface of the substrate holder. The screening member comprises a first screening member configured to rotate about an axis in a first direction perpendicular to the substrate mount surface and screen at least a first area, and a second screening member configured to rotate about the axis and screen at least a second area. The first and second screening members are configured to be rotated to move between a screening position at which the first screening member screens at least the first area and the second screening member screens at least the second area and a retreat position at which the first and second screening members retract from an area above the substrate mount surface and overlap each other.