Rotating Substrate Laser Heating for Selective Local Etching
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving precise and selective etching or heating on rotating substrates, particularly in asymmetric areas, leading to decreased process efficiency and uniformity.
Innovation Solution
A substrate processing method and apparatus that utilizes a laser irradiation assembly synchronized with substrate rotation, employing a Digital Micromirror Device (DMD) to modulate laser irradiation patterns and adjust heating distribution based on substrate surface profiles, allowing for precise control over local etching and heating on rotating substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If light is emitted to a substrate in a stopped state, then the substrate can be heated at a specific area, but the process efficiency decreases because the substrate cannot be heated at the same time as the rotation process
Solution Approach 1:
The patent makes the substrate rotate during laser irradiation instead of keeping it stationary. The support unit rotates the substrate at a controlled speed while the laser irradiation unit irradiates specific areas, enabling simultaneous heating and rotation processing which significantly improves process efficiency
Solution Approach 2:
The patent uses periodic laser irradiation synchronized with substrate rotation. The laser irradiates specific areas periodically as the substrate rotates, allowing precise control of heating patterns while maintaining continuous rotation for improved efficiency and uniformity
2Manufacturing precision
If a processing liquid is supplied to etch the entire pattern on the substrate, then comprehensive etching is achieved, but selective local etching is impossible
Solution Approach 1:
The patent applies laser irradiation to specific local areas of the substrate while processing liquid is supplied to the entire substrate. This creates local heating zones that enable selective etching in specific areas while other areas undergo standard chemical etching, achieving both comprehensive and selective etching simultaneously
Solution Approach 2:
The patent uses laser heating as an intermediary to enhance the etching process. The laser locally heats specific areas to accelerate or enable etching in those zones, while the processing liquid provides the chemical etching mechanism, combining thermal and chemical effects for versatile selective etching
3Manufacturing precision
If DMD is used to form various irradiation patterns, then etching control in various forms is achieved, but precise control in asymmetric areas is difficult
Solution Approach 1:
The patent combines DMD-based laser irradiation with substrate rotation to achieve precise control in asymmetric areas. The rotation provides dynamic movement that, when synchronized with the DMD's irradiation patterns, enables uniform and precise etching across asymmetric geometries that would be difficult to control with static irradiation alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise heating and etching control on rotating substrates with improved etch uniformity and efficiency, facilitating selective processing of asymmetric areas.
Implementation Method 1
irradiating, by the laser irradiation assembly, the rotating substrate, on which a liquid film of the processing liquid is formed, with a laser and heating the substrate
Data Source
AI summary
Disclosed is a substrate processing method including: supplying a processing liquid onto a rotating substrate; and irradiating, by the laser irradiation assembly, the rotating substrate, on which a liquid film of the processing liquid is formed, with a laser to heat the substrate, in which the substrate is divided into one or more unit irradiation areas, the laser irradiation assembly designates any one of the one or more unit irradiation areas and irradiates the designated unit irradiation area with the laser, and synchronizes an oscillation frequency of the laser with a rotation speed of the substrate so that an irradiation position of the laser is the designated unit irradiation area.