Rotating Target Arc Ignition for Uniform Vacuum Deposition
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Solution Overview
Problem
The conventional method of shaving the target surface in vacuum arc deposition leads to reduced target utilization efficiency, decreased throughput, and potential malfunctions due to shaving chips entering the rotating apparatus.
Innovation Solution
A deposition apparatus that rotates and moves the target to change the facing position on its side surface, allowing the striker to generate an arc discharge without shaving the target, thereby improving target utilization efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the target surface is shaved to remove unevenness caused by arc spots, then the deposition uniformity is improved, but the target utilization efficiency decreases and throughput is reduced
Solution Approach 1:
The patent applies the Dynamics principle by making the target rotatable instead of stationary. The target rotation mechanism allows the arc discharge position to be dynamically changed during the deposition process, distributing the arc spot impact across different areas of the target surface. This dynamic approach eliminates the need for periodic shaving operations while maintaining uniform deposition, thereby resolving the contradiction between deposition uniformity and throughput.
2Manufacturing precision
If the target surface is shaved to remove unevenness, then the deposition uniformity is improved, but shaving chips may enter the rotating apparatus causing malfunctions
Solution Approach 1:
By implementing target rotation, the patent eliminates the shaving process entirely. The dynamic redistribution of arc discharge positions through rotation prevents the formation of significant unevenness that would require shaving. This eliminates the source of shaving chips that could enter the rotating apparatus and cause malfunctions, thereby maintaining both deposition uniformity and apparatus reliability.
3Manufacturing precision
If the arc spot is generated only in the center portion of the target surface, then the deposition uniformity is improved, but the peripheral portion of the target remains unused
Solution Approach 1:
The patent employs target rotation to dynamically change the arc discharge position throughout the target surface. As the target rotates, the arc spot is distributed across different radial positions including both central and peripheral areas. This dynamic approach allows the entire target surface to be utilized for deposition while maintaining uniformity, resolving the contradiction between deposition uniformity and target utilization efficiency.
Solution Approach 2:
The patent transitions from a static, two-dimensional arc discharge pattern (center-only) to a dynamic, three-dimensional utilization of the target surface through rotation. By adding the temporal dimension of rotation, the arc discharge can access different areas of the target surface over time, effectively increasing the usable area from the center region to the entire target surface including peripheral portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances target utilization efficiency without the need for shaving, maintains high throughput, and prevents malfunctions by eliminating the need for a grinder and the associated risks of shaving chips.
Implementation Method 1
generating an arc discharge between the target and the anode arranged near the target. The arc discharge is generated by bringing a striker connected to the anode closer to or into contact with the target
Implementation Method 2
a rotation unit configured to rotate a target about a rotating axis
Implementation Method 3
a deposition method (vacuum arc deposition) which uses an arc discharge and can form a thinner carbon protection film
Data Source
AI summary
A deposition apparatus, which forms a film on a substrate, includes a rotation unit configured to rotate a target about a rotating axis; a striker configured to generate an arc discharge; a driving unit configured to drive the striker so as to make a close state which the striker closes to a side surface around the rotating axis of the target to generate the arc discharge; and a control unit configured to control rotation of the target by the rotation unit so as to change a facing position on the side surface of the target facing the striker in the close state.