Rotating Multi-Material Target Plate for Uniform Ion Beam Deposition

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Solution Overview

Problem

Current ion beam deposition methods are limited in their ability to form a single deposition layer comprising multiple materials uniformly on a substrate, often resulting in non-uniform deposition and increased process time.

Innovation Solution

An ion beam deposition apparatus and method that includes a target plate with alternating regions of different materials, where the target plate and/or substrate are rotated during the ion beam irradiation process to ensure uniform distribution of materials onto the substrate, allowing for the formation of a single deposition layer with controlled properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a single target plate with multiple materials is used, then deposition time is reduced, but deposition uniformity deteriorates

Engineering Contradiction:
Improvedeposition timeVSAvoiddeposition uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The target plate is divided into multiple distinct material regions (first region with first material, second region with second material, third region with third material). By segmenting the target plate into functionally distinct zones, each material can be deposited independently while maintaining overall process efficiency and deposition uniformity across the substrate.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If multiple deposition processes are used for multiple materials, then deposition uniformity is improved, but process time increases

Engineering Contradiction:
Improvedeposition uniformityVSAvoidprocess time
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

Multiple material regions are merged into a single integrated target plate structure. This allows simultaneous or sequential deposition of multiple materials in one continuous process, combining what would traditionally require separate deposition steps into a single operation, thereby reducing total process time while maintaining uniformity through controlled rotation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The target plate is rotated during the deposition process to dynamically expose different material regions to the ion beam. This rotational movement ensures uniform distribution of multiple materials across the substrate, achieving deposition uniformity without requiring multiple static deposition steps, thus reducing overall process time.

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If the target plate is rotated during deposition, then material distribution uniformity is improved, but process complexity increases

Engineering Contradiction:
Improvematerial distribution uniformityVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A simple rotational mechanism is introduced to the target plate, transforming it from a static to a dynamic component. This single degree of freedom (rotation) enables uniform material distribution across the substrate by sequentially exposing different material regions to the ion beam, achieving improved uniformity with minimal added mechanical complexity.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the formation of a uniform deposition layer with multiple materials in a single process, reducing process time and allowing for adjustment of deposition layer properties by varying the rotation speed of the target plate.

Implementation Method 1

irradiating an ion beam from an ion beam source toward a target plate

Methodology Applied
Scientific EffectIon beam: Ion Beam

Implementation Method 2

When the ion beam is irradiated to the target, the specific constituent may come out to move onto a substrate. The specific constituent sputtered toward the substrate may be deposited on the substrate.

Methodology Applied
Scientific EffectSputtering: Sputtering

Implementation Method 3

an ion beam deposition process in which an ion beam is used... The specific constituent sputtered toward the substrate may be deposited on the substrate.

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS20240071712A1Ion beam deposition apparatus and ion beam deposition method using the same
Publication Date: 2024.02.29 SAMSUNG ELECTRONICS CO LTD
  • US20240071712A1 patent drawing
  • US20240071712A1 patent drawing
  • US20240071712A1 patent drawing

AI summary

An ion beam deposition method includes placing a substrate into an ion beam deposition apparatus, irradiating an ion beam from an ion beam source toward a target plate, and rotating the target plate during the irradiating of the ion beam. The target plate includes a first region that includes a first material, and a second region that includes a second material different from the first material.