Rotating Vane Cover Cooling for Uniform Airflow in Spinning Assemblies
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Solution Overview
Problem
Existing air cooling systems for electronic spinning assemblies in vehicles, such as those used in autonomous vehicles, often fail to adequately cool all areas, including heat sinks and camera arrays, due to design limitations and airflow inefficiencies.
Innovation Solution
A system utilizing static vanes and a rotating vane cover that draws air from below the assembly, directs it through ducts, and uses choke points to increase airflow pressure, ensuring uniform cooling across the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an impeller is used to pull air through the electronic spinning assembly, then air can be forced through the assembly to provide cooling, but the cooling effectiveness is insufficient and cannot reach all areas such as heat sinks and camera arrays
Solution Approach 1:
The housing is divided into multiple segments with individual air inlets and air outlets. Each segment can independently direct airflow to specific areas requiring cooling, such as heat sinks and camera arrays, ensuring comprehensive coverage throughout the electronic spinning assembly
Solution Approach 2:
Different segments of the housing are configured with specific inlet and outlet positions to deliver cooling air to different local areas of the assembly. This allows tailored cooling solutions for different components based on their specific thermal requirements and locations
2Productivity
If air is blown through the electronic spinning assembly, then cooling is provided, but the airflow does not adequately reach all areas that need cooling
Solution Approach 1:
The housing is divided into multiple segments with individual air inlets and air outlets. Each segment can independently direct airflow to specific areas requiring cooling, ensuring comprehensive coverage throughout the electronic spinning assembly
Solution Approach 2:
The system utilizes the rotational movement of the electronic spinning assembly to dynamically distribute airflow. As the assembly rotates, different segments pass through the airflow path, ensuring all areas receive cooling over time while the impeller maintains continuous air circulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cools electronic spinning assemblies by ensuring uniform airflow distribution, preventing overheating and maintaining optimal operating conditions.
Implementation Method 1
air can be drawn up from below the assembly through the static vanes and up a plurality of ducts in the rotating cover to cool the spinning assembly
Implementation Method 2
at least one choke point disposed in the cover, wherein the at least one choke point is configured to increase a pressure of the airflow
Implementation Method 3
The system effectively cools electronic spinning assemblies by ensuring uniform airflow distribution, preventing overheating and maintaining optimal operating conditions
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
Example embodiments relate to an air cooling system for an electronic spinning assembly. An example embodiment includes a plurality of vanes coupled to a static base. A vane cover is rotatably coupled to the static base. The vane cover at least partially encloses the plurality of vanes. Additionally, the vane cover is coupled to an electronic spinning assembly and configured to rotate with the spinning assembly. The vane cover further includes at least one air inlet configured to act as an air intake for an airflow, at least one air duct extending from the vane cover and configured to direct the airflow, and at least one choke point disposed in the cover. The at least one choke point is configured to increase a pressure of the airflow.