Rotating Wafer Support Temperature Sensing via Wireless Transmission

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Solution Overview

Problem

Existing semiconductor processing technologies face challenges in accurately controlling and measuring the temperature of wafers during heating processes, especially when the wafer support portion rotates, as heat is lost to the environment and direct temperature sensing is difficult due to the rotating movement.

Innovation Solution

Integration of temperature sensors within the wafer support assembly and a WiFi connectivity module for wireless signal transmission to an external control module, allowing for accurate temperature measurement and control of the wafer support assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heater is disposed under the wafer support portion to heat the wafer, then the wafer can be heated to elevated temperature, but significant heat is lost to the surrounding environment through radiation in vacuum/low pressure environment, making it difficult to control the temperature accurately

Engineering Contradiction:

Improvewafer temperatureVSAvoidheat loss

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The patent introduces a temperature sensing system with a temperature sensor integrated in the wafer support assembly and a WiFi connectivity module as an intermediary between the heater and the control system. This intermediary enables precise temperature monitoring and wireless communication, allowing the control system to adjust heater power dynamically to minimize heat loss while maintaining desired wafer temperature.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the wafer support portion rotates during processing, then film deposition can be achieved, but direct temperature sensing becomes difficult and optical sensing only provides temperature at one or a few locations, not across the entire wafer

Engineering Contradiction:

Improvefilm deposition capabilityVSAvoidtemperature measurement accuracy

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The patent replaces the mechanical/optical temperature sensing approach with a wireless electronic sensing system. The temperature sensor integrated in the wafer support assembly directly measures temperature without requiring optical access, and the WiFi connectivity module wirelessly transmits this data to the external system, eliminating the need for complex mechanical sensing arrangements that would be required for rotating components.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The temperature sensor is integrated directly into the wafer support assembly, allowing it to self-measure the temperature at the source without requiring external sensing equipment. This self-service approach enables accurate temperature monitoring throughout the rotation cycle without interfering with the deposition process.

Inventive Principle:

Principle #25Self-service

3Measurement precision

If a thermocouple is disposed inside a tube of the wafer support structure with a wire connection, then temperature can be measured, but the wire connection complicates the rotating structure and may interfere with the vacuum environment

Engineering Contradiction:

Improvetemperature measurementVSAvoidstructure complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical wire connection system with a wireless communication system. The WiFi connectivity module transmits temperature data wirelessly to the external system, eliminating the need for physical wire connections through the vacuum boundary and simplifying the rotating structure by removing sliding contacts or flexible cables.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise temperature measurement and control of the wafer support assembly, improving heat transfer efficiency and reducing heat loss, thereby achieving more accurate temperature control of the wafer during processing.

Implementation Method 1

a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly

Methodology Applied

Scientific EffectTemperature sensing: Thermal Radiation

Implementation Method 2

the heat is transferred from the heater to the rotating wafer support portion primarily through radiation in a vacuum/low pressure environment of the processing chamber

Methodology Applied

Scientific EffectRadiation heat transfer: Thermal Radiation

Data Source

PatentEP3414541B1Temperature sensing system for rotatable wafer support assembly

Publication Date: 2020.09.30 WATLOW ELECTRIC MANUFACTURING CO

Figure 1
Figure 2

AI summary

A semiconductor processing apparatus includes a wafer support assembly, a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly, and a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.