Rotational Mounting Semiconductor Power Device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for smaller, higher-performance electronic devices with improved reliability and reduced costs is hindered by inefficient heat dissipation in semiconductor components, leading to instability and overheating issues, which complicates board design and increases costs.
Innovation Solution
An electronic component with a semiconductor power device featuring a geometrically arranged contact structure and rewiring system that allows for flexible rotational mounting on substrates without altering performance, ensuring compatibility with various orientations and simplifying board design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the semiconductor power device is mounted in a fixed orientation on the substrate, then the electrical connections are straightforward, but the board design complexity increases and additional external heat dissipaters are required
Solution Approach 1:
The contact surfaces are arranged asymmetrically with respect to the semiconductor chip orientation, allowing the component to be mounted in multiple rotational orientations (e.g., 0°, 90°, 180°, 270°) while maintaining proper electrical connections. The rewiring structure internally compensates for the rotational orientation, mapping the contact surfaces to the appropriate chip electrodes regardless of rotation angle.
Solution Approach 2:
The same set of contact surfaces can serve multiple mounting orientations without requiring different pad layouts or additional components. The rewiring structure provides universal connectivity that adapts to various rotational positions, eliminating the need for orientation-specific design constraints.
2Temperature
If heat dissipation is improved by using additional external heat dissipaters, then thermal management is enhanced, but the cost and device complexity increase
Solution Approach 1:
The mounting structure integrates multiple functions: it provides both mechanical support and thermal conduction pathways. The contact surfaces and rewiring structure serve dual purposes of electrical connection and heat dissipation, eliminating the need for separate external heat dissipaters.
Solution Approach 2:
The electronic component's own mounting structure and contact surfaces provide the heat dissipation function that would otherwise require external components. The thermal management is achieved through the component's inherent structure rather than additional dedicated heat dissipation devices.
3Reliability
If the component pad layout is fixed for a specific orientation, then electrical connections are optimized, but rotational reorientation causes performance deterioration
Solution Approach 1:
The contact surface arrangement and rewiring structure are designed with asymmetric characteristics that allow rotational symmetry in functionality. When rotated by specific angles (e.g., 90°, 180°, 270°), the contact surfaces map to equivalent electrical connections, maintaining performance consistency across different orientations.
Solution Approach 2:
The system allows changes in mounting orientation parameters (rotation angles) while maintaining electrical connection integrity through the rewiring structure's adaptive mapping capability. The contact surfaces' spatial arrangement parameters are designed to accommodate rotational transformations.
Data Source
AI summary
An electronic component adapted to be mounted on a substrate with landing pads having a landing pad layout has a power semiconductor device and outer contact surfaces with a component pad layout. The outer contact surfaces have an arrangement so that, in a first orientation, the component pad layout matches the landing pad layout and in a rotational reorientation of the entire electronic component about the component axis by an angle other than 360°, the outer contact surfaces are translated to each other so that the component pad layout matches the landing pad layout.