Rotational Pressure-Insensitive Temperature Sensor

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Solution Overview

Problem

Temperature sensors used in downhole environments face challenges in maintaining robustness and insensitivity to pressure changes, requiring innovative designs to effectively monitor temperature in harsh conditions.

Innovation Solution

A temperature sensor design featuring a substrate with a low coefficient of thermal expansion and a conductive plate with a higher expansion coefficient, where the conductive plate generates mechanical force and adjusts capacitance in response to temperature, shifting a signal frequency for accurate temperature measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a temperature sensor is designed to be robust for harsh downhole environments, then reliability is improved, but sensitivity to pressure changes increases

Engineering Contradiction:
ImproverobustnessVSAvoidpressure sensitivity
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs a bi-metallic strip composed of two metals with different coefficients of thermal expansion (e.g., brass and invar). When temperature changes, the differential expansion causes the strip to bend, which mechanically actuates the capacitance sensor. This thermal expansion mechanism enables temperature sensing while the mechanical coupling inherently isolates the sensing element from direct pressure effects, resolving the contradiction between robustness and pressure sensitivity

Inventive Principle:
Principle #37Thermal expansion

Solution Approach 2:

The patent replaces traditional electrical temperature sensing mechanisms with a mechanical-biometric system. The bi-metallic strip converts thermal energy into mechanical displacement, which then modulates a capacitance sensor. This mechanical substitution approach allows the sensor to measure temperature through mechanical means that are inherently less sensitive to pressure changes, thereby improving reliability while reducing pressure sensitivity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If a temperature sensor uses a bi-metallic strip mechanism, then temperature measurement accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature accuracyVSAvoidsensor structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges the temperature-to-mechanical conversion function (bi-metallic strip) with the mechanical-to-electrical conversion function (capacitance sensor) into a single integrated device. The bi-metallic strip is directly coupled to the capacitance sensing element, eliminating the need for separate transduction mechanisms. This merging reduces overall device complexity while maintaining high temperature measurement accuracy through the combined biometric-capacitive system

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes changes in physical parameters (thermal expansion coefficients, capacitance values) to achieve temperature measurement. By selecting materials with specific thermal expansion characteristics and designing the capacitance sensor with appropriate geometric parameters, the system achieves high measurement precision. The parameter changes approach allows accurate temperature sensing without requiring complex electronic circuitry or multiple sensing elements

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sensor effectively measures temperature across a wide range (40° F to 600° F) with high accuracy and resilience, maintaining operational integrity despite pressure variations, enabling reliable downhole monitoring.

Implementation Method 1

a first conductive plate formed of a material having a second coefficient of thermal expansion that is higher than the first coefficient of thermal expansion

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a second conductive element configured and arranged to vary a capacitance in response to the mechanical force

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 3

shifting the frequency of the generated signal based on a rotation of the first conductive plate or second conductive plate due to the temperature of the enclosure

Methodology Applied
Scientific EffectFrequency modulation: Phase Modulation

Data Source

PatentUS8083405B2Pressure sensor having a rotational response to the environment
Publication Date: 2011.12.27 CHEVRON USA INC
  • US8083405B2 patent drawing
  • US8083405B2 patent drawing
  • US8083405B2 patent drawing

AI summary

Methods and systems of the invention are directed to a pressure sensor that includes a substrate, a first conductive plate, and a second conductive plate. The substrate is formed of a material having a low coefficient of thermal expansion (CTE). The first conductive plate is formed of a material having a CTE that is higher than the CTE of the substrate, and is attached to a first surface of the substrate. The second conductive plate is rotatably connected to the substrate through a hinge, and includes a portion that is adjacent to the first conductive plate.