Rotational Ring Cleaning in Substrate Processing Flow Paths
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently removing residual chemical liquids and residues from rotational and exhaust flow paths, leading to particle adhesion and clogging, which can affect substrate quality and maintenance frequency.
Innovation Solution
The apparatus incorporates first and second rotational rings to guide processing liquids obliquely, a recovery cup for collecting splashed liquids, and nozzles to periodically eject cleaning liquids into rotational and exhaust flow paths, utilizing rinse liquids and gases to dissolve and remove residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If rotational rings are used to guide processing liquid, then substrate processing effectiveness is improved, but residue accumulation in the rotational flow path occurs
Solution Approach 1:
The patent applies preliminary action by periodically ejecting cleaning liquid into the rotational flow path before residue accumulation becomes problematic. The cleaning liquid is supplied at predetermined intervals to prevent clogging and particle adhesion, maintaining the effectiveness of the rotational rings while addressing residue accumulation proactively.
2Reliability
If cleaning liquid is supplied frequently, then residue removal is improved, but processing time and complexity increase
Solution Approach 1:
The patent implements periodic action by supplying cleaning liquid at predetermined intervals rather than continuously. The control unit is configured to eject cleaning liquid into the rotational flow path periodically, which effectively removes residues while minimizing interference with the substrate processing time and reducing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the removal of residues in rotational and exhaust flow paths, reducing particle adhesion and clogging, thereby improving substrate quality and reducing maintenance needs.
Implementation Method 1
a first rotational ring that surrounds a peripheral edge of a lower surface of the substrate held by the substrate holding unit, and rotates together with the substrate holding unit, and a second rotational ring that is provided outside the first rotational ring, surrounds a peripheral edge of an upper surface of the substrate held by the substrate holding unit, and rotates together with the substrate holding unit
Implementation Method 2
The first nozzle ejects a cleaning liquid from above an entrance of a rotational flow path toward the entrance of the rotational flow path, the rotational flow path being formed between the first rotational ring and the second rotational ring
Data Source
AI summary
A substrate processing apparatus includes a substrate holding unit, a rotation driving unit, a first rotational ring, a second rotational ring, and a first nozzle. The substrate holding unit includes a base plate and a plurality of gripping units that grips a peripheral edge of a substrate, and horizontally holds the substrate spaced apart from the base plate by the gripping units. The rotation driving unit rotates the substrate holding unit. The first rotational ring surrounds a peripheral edge of a lower surface of the substrate and rotates together with the substrate holding unit. The second rotational ring is provided outside the first rotational ring, surrounds a peripheral edge of an upper surface of the substrate, and rotates together with the substrate holding unit. The first nozzle ejects a cleaning liquid from above an entrance of a rotational flow path toward the entrance of the rotational flow path.