Rough-Surface Capacitive Pressure Sensor With Low-Cost High Sensitivity

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Solution Overview

Problem

Highly sensitive pressure sensors are hindered by the high costs of materials like gold, silver, and carbon nano tubes, and complex processes such as photo-lithography, which limit their commercialization and make them unsuitable for widespread use in IoT applications.

Innovation Solution

A pressure sensor design using a flexible substrate with surface roughness and a dielectric layer made from elastomer, which reduces material and processing costs, and enhances sensitivity by forming an interlocked structure and air layers between electrodes, allowing for effective capacitance variation detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If expensive materials like gold, silver, metal nano wire, ITO, and carbon nano tube are used for electrodes, then sensing sensitivity is improved, but material cost increases significantly

Engineering Contradiction:
Improvesensing sensitivityVSAvoidmaterial cost
Core Design Contradiction:
Measurement precisionVSQuantity of substance

Solution Approach 1:

The patent replaces expensive electrode materials (gold, silver, metal nano wire, ITO, carbon nano tube) with inexpensive alternatives such as aluminum, copper, or conductive polymer. This substitution dramatically reduces material cost while maintaining acceptable sensing performance through optimized electrode geometry and surface roughness rather than relying on expensive materials

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes physical parameters of the electrode structure, specifically introducing surface roughness (Ra ≥ 0.1 μm) and optimizing electrode thickness and pattern. These parameter changes enhance the effective sensing area and electric field distribution, compensating for the lower conductivity of cheaper materials and achieving high sensitivity without expensive substances

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If complicated processes like photo-lithography and etching are used to form micro-structure, then sensing sensitivity is improved, but process cost and complexity increase significantly

Engineering Contradiction:
Improvesensing sensitivityVSAvoidprocess complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent employs self-organizing or self-assembling processes to create the necessary micro-structures. For example, chemical etching methods that naturally form rough surfaces without requiring precise photo-lithography masks, or dip-coating techniques that automatically create uniform dielectric layers. These self-service approaches eliminate complex multi-step fabrication while achieving the required micro-structural features for high sensitivity

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent extracts and eliminates the most complex steps from traditional fabrication processes. Instead of using full photo-lithography and reactive ion etching sequences, the invention adopts simpler methods such as screen printing, spray coating, or chemical etching that directly produce the needed electrode patterns and surface roughness, removing unnecessary process complexity while retaining sensitivity enhancement

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If simple materials and processes are used, then manufacturing cost is reduced, but sensing sensitivity decreases

Engineering Contradiction:
Improvemanufacturing costVSAvoidsensing sensitivity
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent applies local quality enhancement by creating non-uniform electrode structures with specific surface roughness in critical sensing regions. The electrode surface is engineered to have increased roughness (Ra ≥ 0.1 μm) at the contact area with the dielectric, which locally enhances the electric field and sensing sensitivity. This localized optimization allows simple materials to achieve high performance where it matters most without requiring complex materials throughout the entire structure

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite structures combining simple materials with optimized geometries. For instance, a composite of conductive polymer and roughened substrate, or aluminum electrode with textured surface and specific dielectric coating. These composite configurations leverage the synergistic effects of material properties and structural features to achieve high sensitivity using low-cost components, bridging the gap between simple materials and high performance

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the creation of a low-cost, highly sensitive pressure sensor that can detect pressure variations with high accuracy, suitable for various IoT applications, including flexible input devices, without the need for expensive materials or complex manufacturing processes.

Implementation Method 1

a first electrode having surface roughness is formed; an upper substrate on which a second electrode having surface roughness is formed

Methodology Applied
Scientific EffectSurface roughness:

Implementation Method 2

An interlocked structure may be formed by engaging of at least a portion of surfaces of the lower dielectric layer and the upper dielectric layer

Methodology Applied
Scientific EffectInterlocked structure:

Implementation Method 3

An air layer may be formed in a portion of a region between the lower dielectric layer and the upper dielectric layer

Methodology Applied
Scientific EffectCapacitance variation: Capacitance

Data Source

PatentUS10401974B2Highly sensitive pressure sensor and input device using the same
Publication Date: 2019.09.03 IND ACADEMIC COOP FOUND YONSEI UNIV
  • US10401974B2 patent drawing
  • US10401974B2 patent drawing
  • US10401974B2 patent drawing

AI summary

Provided is a highly sensitive pressure sensor that includes a lower substrate on which a first electrode having surface roughness is formed; an upper substrate on which a second electrode having surface roughness is formed; and a dielectric material stacked between the lower substrate and the upper substrate to be disposed between the first electrode and the second electrode.