Roughened Carrier Structure for LED Light Outcoupling
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Solution Overview
Problem
Existing optoelectronic semiconductor devices face challenges in enhancing the outcoupling efficiency of electromagnetic radiation, which is crucial for improving their performance.
Innovation Solution
The design involves a carrier with a roughened first main surface and an optoelectronic semiconductor chip arranged over it, where the chip's surface area is smaller than the carrier's, and a dielectric mirror layer is applied to the carrier's second main surface, along with an amorphous inorganic connecting material for attachment, and a reflective potting compound is introduced between the carrier and housing to enhance radiation reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the carrier surface area is increased to improve outcoupling efficiency, then the radiation emission surface area increases, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The device is segmented into distinct functional zones: the carrier with roughened surface for light emission, the lead frame for electrical connection, and the housing for protection. This segmentation allows each component to be optimized independently while maintaining overall system performance.
Solution Approach 2:
The carrier is designed to extend beyond the lead frame in lateral dimensions, creating a multi-layered structure where the carrier's larger surface area provides enhanced outcoupling without increasing the footprint of the electrical connection area. This dimensional differentiation resolves the contradiction between emission surface area and device complexity.
2Reliability
If the carrier completely covers the lead frame to improve structural integrity and radiation reflection, then the outcoupling efficiency improves, but the manufacturing precision requirements increase
Solution Approach 1:
The carrier is designed with pre-defined lateral extensions that automatically cover the lead frame when components are assembled in sequence. This preliminary design of coverage geometry eliminates the need for high-precision alignment during assembly, reducing manufacturing precision requirements while maintaining structural integrity.
Solution Approach 2:
The carrier exhibits different functional properties in different regions: the area covering the lead frame provides structural support and radiation reflection, while the exposed areas provide additional outcoupling surface. This local differentiation of function allows the carrier to meet multiple requirements simultaneously with relaxed precision constraints.
3Productivity
If the roughened surface area is increased to enhance light emission, then the outcoupling efficiency improves, but the material consumption and manufacturing cost increase
Solution Approach 1:
The carrier is designed with excessive lateral extension beyond the lead frame, providing more roughened surface area than strictly necessary for basic functionality. This excessive action ensures maximum outcoupling efficiency is achieved without requiring precise optimization, balancing material consumption against performance gains.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the outcoupling efficiency of electromagnetic radiation by increasing the surface area for radiation emission and reducing absorption, leading to enhanced performance of the optoelectronic semiconductor device.
Implementation Method 1
A light emitting diode (LED) is a light emitting device based on semiconductor materials. When electrons and holes recombine with one another in the region of the pn junction, due, for example, to a corresponding voltage being applied, electromagnetic radiation is generated.
Implementation Method 2
concepts are being sought which allow for the outcoupling efficiency of optoelectronic semiconductor devices to be improved
Implementation Method 3
the optoelectronic semiconductor apparatus may further comprise a reflective potting compound which is introduced between the carrier and the housing
Data Source
AI summary
An optoelectronic semiconductor device may include a carrier having a roughened first main surface and optoelectronic semiconductor chips arranged over the roughened first main surface. The combined surface area of the optoelectronic semiconductor chips is smaller than the surface area of the carrier, and a part of the roughened first main surface is arranged between adjacent optoelectronic semiconductor chips.