Roughened Microfiber Tips for Wafer Grip and Clean Release
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Solution Overview
Problem
Conventional methods for handling semiconductor devices during fabrication, such as elastomer pads and vacuum clamping, introduce contamination and risk of damage due to high adhesive forces, while pressure sensitive adhesives leave residues and are difficult to release, necessitating a solution for controlled friction and minimal adhesion.
Innovation Solution
A microfiber array with roughened tips is used, providing controlled friction and near-zero adhesion, allowing for rapid movement and easy release of semiconductor devices during processing, comprising micro- or nano-scale fibers with enlarged, shaped tips that contact the surface to enhance friction without adhering excessively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If elastomer pads are used for handling semiconductor devices, then friction is provided for device movement, but contamination is introduced due to material wear
Solution Approach 1:
The patent employs a porous polymer foam substrate that provides structural support while allowing the microfiber array to function independently. The porous structure enables the fibers to be spaced apart and contact the wafer surface without the entire pad material wearing down and contaminating the device.
Solution Approach 2:
The invention divides the handling surface into numerous individual microfibers rather than using a continuous elastomer pad. Each fiber acts as an independent contact point, reducing the total surface area in contact with the wafer and minimizing wear-related contamination while maintaining sufficient friction through the collective action of many fibers.
2Strength
If vacuum clamping is used for handling semiconductor devices, then secure holding is achieved, but damage or contamination occurs due to high adhesive forces
Solution Approach 1:
The microfiber array concentrates the holding function at the tip regions of individual fibers rather than distributing adhesive forces across a large continuous surface. The tips provide localized friction-based holding without the high normal adhesion forces that cause damage with vacuum clamping or pressure-sensitive adhesives.
Solution Approach 2:
The invention replaces the adhesive or vacuum-based mechanical holding system with a friction-based mechanism. Instead of relying on normal adhesion forces that can damage devices, the microfiber tips generate sufficient friction through their geometry and material properties to secure the wafer during handling.
3Strength
If pressure sensitive adhesives are used for handling semiconductor devices, then strong adhesion is achieved, but residue is left and release requires increased effort
Solution Approach 1:
The invention extracts the adhesion function entirely from the handling system and replaces it with friction-based holding. By removing adhesive materials completely, the system eliminates residue deposition on the wafer and allows for easy, residue-free release without requiring increased effort.
4Productivity
If high friction is used for rapid acceleration of semiconductor wafers, then throughput is improved, but vertical adhesion increases causing damage risk
Solution Approach 1:
The microfiber tips are designed with specific geometric characteristics at their contact points that generate high friction coefficients for lateral force transmission during wafer acceleration. Simultaneously, the overall fiber structure and material composition maintain low normal adhesion forces in the vertical direction, preventing damage during rapid throughput operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microfiber array enables efficient and contamination-free handling of semiconductor devices by maintaining high friction for rapid processing while minimizing adhesion, reducing the risk of damage and contamination, and improving throughput and yield.
Implementation Method 1
The tips make contact with the surface of the wafer or other object and provide a friction force
Data Source
AI summary
A microfiber array comprising a plurality of fibers with roughened tips, where the microfiber array is adapted to provide enhanced grip to the surface of a semiconductor device and other smooth, flat objects. The microfiber array provides friction against movement in the horizontal direction, while providing controllable adhesion to allow for easy separation in the vertical direction.