Roughened Plate Pack for Compact Chiller Heat Transfer

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Solution Overview

Problem

Shell and plate heat exchangers face challenges in achieving a sufficient heat transfer coefficient for practical use as condensers or evaporators in water-cooled chiller applications, with existing coefficients being insufficient for efficient operation.

Innovation Solution

The design incorporates a shell and plate heat exchanger with a plate pack featuring heat exchanger plates having surface roughness between 5 μm and 100 μm, and optionally s-grooves or r-grooves, to enhance heat transfer performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If shell and plate heat exchanger is used instead of shell and tube heat exchanger, then footprint and space occupation are reduced, but heat transfer coefficient is insufficient for water-cooled chiller applications

Engineering Contradiction:
ImprovefootprintVSAvoidheat transfer coefficient
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent applies surface roughness parameter changes to the heat exchanger plates, specifying a roughness range of 0.5 μm to 10 μm to optimize heat transfer coefficient while maintaining the compact shell and plate structure

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces localized groove structures (s-grooves and r-grooves) at specific locations on the heat exchanger plates to enhance heat transfer in critical areas, providing local quality improvement without compromising overall compactness

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If shell and plate heat exchanger is used instead of shell and tube heat exchanger, then smaller amount of refrigerant can be used, but heat transfer coefficient is insufficient

Engineering Contradiction:
Improverefrigerant amountVSAvoidheat transfer coefficient
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent modifies the surface roughness parameter of the plates to between 0.5 μm and 10 μm, which enhances the heat transfer coefficient to compensate for the reduced refrigerant quantity, making the shell and plate design viable for water-cooled chillers

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

Groove structures are introduced at specific locations on the plates to create localized turbulence and enhance heat transfer in key areas, ensuring sufficient heat transfer performance with less refrigerant

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If smooth surface plates are used, then manufacturing is easier, but heat transfer coefficient is too low for practical application

Engineering Contradiction:
Improveplate manufacturingVSAvoidheat transfer coefficient
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent specifies a controlled surface roughness range of 0.5 μm to 10 μm, which can be achieved through standard manufacturing processes like sandblasting or roller compaction, balancing manufacturability with enhanced heat transfer coefficient

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

Groove structures are added only in specific locations on the plates rather than across the entire surface, maintaining ease of manufacture while providing localized heat transfer enhancement where most needed

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the heat transfer coefficient, achieving up to three times the current coefficient, making the shell and plate heat exchanger suitable for water-cooled chiller applications by optimizing heat transfer during evaporation and condensation.

Implementation Method 1

heat exchange occurs between the refrigerant and a first heat exchange medium... heat is transferred to the first heat exchange medium

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the refrigerant condenses in this heat exchanger... refrigerant is compressed in the compressor and sent to a heat exchanger in which heat exchange occurs

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

refrigerant is evaporated in this heat exchanger... heat exchange occurs between the refrigerant and a second heat exchange medium

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS11976856B2Shell and plate heat exchanger for water-cooled chiller and water-cooled chiller including the same
Publication Date: 2024.05.07 DAIKIN INDUSTRIES LTD
  • US11976856B2 patent drawing
  • US11976856B2 patent drawing
  • US11976856B2 patent drawing

AI summary

A shell and plate heat exchanger includes a shell and a plate pack. The shell defines a cavity configured to receive a first fluid and a second fluid. The plate pack is arranged inside the cavity. The plate pack has a plurality of heat exchanger plates. Each of the heat exchanger plates has two sides facing in opposite directions in a thickness direction of the heat exchanger plate. At least one of the sides of at least one of the heat exchanger plates has a surface roughness of between 5 μm and 100 μm.