Roughened Rewiring Surfaces for Resin-Sealed Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor devices face issues with resin peeling off due to inadequate adhesive force between the resin and the rewiring or post electrodes, leading to reliability concerns in packaging.
Innovation Solution
The semiconductor device incorporates a roughened second wiring surface or electrode lateral surface to increase the adhesive force of the resin, using a combination of a thermosetting resin with fillers of varying diameters to fill recesses and cover the rewiring and post electrodes, enhancing the resin's anchoring effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a smooth rewiring surface is used, then the manufacturing process is simple, but the resin adhesive force is insufficient causing peeling
Solution Approach 1:
The rewiring surface is roughened in advance before resin application through etching or plating processes. This preliminary surface treatment creates anchor points and increases surface area, ensuring strong adhesive force when the resin is subsequently applied, thereby preventing resin peeling while maintaining manufacturing feasibility
Solution Approach 2:
The rewiring surface is transformed into a porous or uneven structure through roughening treatments. This creates a micro-porous surface topology that allows resin to penetrate and mechanically interlock, significantly enhancing adhesive strength without requiring complex additional components
2Strength
If a smooth post electrode lateral surface is used, then the manufacturing process is simple, but the resin adhesive force is insufficient causing peeling
Solution Approach 1:
The post electrode lateral surface is roughened in advance through etching or plating before resin encapsulation. This preliminary treatment creates surface irregularities and anchor points that significantly improve resin adhesion, preventing peeling while avoiding the need for complex additional fastening mechanisms
Solution Approach 2:
The post electrode lateral surface is converted into a porous or uneven structure through surface roughening. This porous topology enables resin penetration and mechanical interlocking, substantially enhancing adhesive strength without complicating the overall device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents resin peeling off by increasing the adhesive force between the resin and the rewiring or post electrodes, ensuring improved reliability and durability of the semiconductor device packaging.
Implementation Method 1
a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened
Implementation Method 2
an electrode lateral surface that connects the first electrode surface and the second electrode surface together and that is roughened
Data Source
AI summary
A semiconductor device includes a semiconductor layer that has a main surface, an electrode pad that is formed on the main surface, a rewiring that has a first wiring surface connected to the electrode pad and a second wiring surface positioned on a side opposite to the first wiring surface and being roughened, the rewiring being formed on the main surface such as to be drawn out to a region outside the electrode pad, and a resin that covers the second wiring surface on the main surface and that seals the rewiring.