Roughened Flexible Substrate for Foldable Display Bonding

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Solution Overview

Problem

Current display panels using flexible polyimide substrates face issues with weak bonding forces between polyimide and silicon dioxide buffer layers, leading to peeling when bent, which affects display quality.

Innovation Solution

A display panel with a rough structure on the flexible substrate surface in contact with the buffer layer, featuring a carboxylic acid group that forms a chemical bond with silicon dioxide, enhancing the bonding force and preventing peeling in bending areas, and optionally extending to non-bending areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If polyimide flexible substrate is used to achieve foldable design, then flexibility and foldable capability are improved, but bonding force between substrate and buffer layer becomes weak causing peeling

Engineering Contradiction:
Improvefoldable capabilityVSAvoidbonding force
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The invention applies different surface treatments to different regions of the flexible substrate. A rough structure is formed specifically in the bending area through controlled chemical etching, while other areas maintain their original smooth surface. This local differentiation enhances bonding strength precisely where mechanical stress occurs during folding, without compromising the overall flexibility of the substrate.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The rough structure is pre-formed on the flexible substrate before the buffer layer is deposited. This preliminary surface modification ensures that when the silicon dioxide buffer layer is subsequently deposited, it bonds to the enhanced rough surface in the bending area, preventing peeling issues that would occur with the original smooth polyimide surface during folding operations.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If surface cleaning is performed to reduce particles, then particle contamination is reduced, but bonding force between substrate and buffer layer remains insufficient

Engineering Contradiction:
Improveparticle reductionVSAvoidbonding force
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The invention changes the surface morphology parameter of the flexible substrate by forming a rough structure through controlled chemical etching. This parameter change increases the surface area and creates anchoring features that significantly enhance bonding strength, going beyond the limited effect of mere surface cleaning and particle removal.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The enhanced bonding force improves display panel durability and reliability by preventing peeling in both bending and non-bending areas, ensuring excellent display quality and high product yield through a simple and controllable manufacturing process.

Implementation Method 1

a chemical bond is formed between material molecules of the rough structure and material molecules of the buffer layer

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Implementation Method 2

the rough structure is made of a material comprising a carboxylic acid group, and a chemical bond is formed between the carboxylic acid group and the silicon dioxide

Methodology Applied
Scientific EffectSilane coupling:

Data Source

PatentUS12035609B2Display panel including roughened surface flexible substrate
Publication Date: 2024.07.09 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
  • US12035609B2 patent drawing
  • US12035609B2 patent drawing
  • US12035609B2 patent drawing

AI summary

A display panel and a method of manufacturing the same are disclosed. The display panel includes a bending area. The display panel includes a first flexible substrate. A buffer layer is disposed on a surface of the first flexible substrate. A rough structure is disposed on a surface of the first flexible substrate in contact with the buffer layer in the bending area.