Rounded Die Corner Structure for Reliable Semiconductor Packaging
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Solution Overview
Problem
Integration of multiple semiconductor devices into a single package is challenging due to thermal and mechanical stresses, which can lead to reliability issues and increased costs in manufacturing.
Innovation Solution
A semiconductor package design that includes an interposer with through semiconductor vias (TSVs) and semiconductor dies bonded via connectors, with an underfill and corner padding materials to secure the electrical connection and reduce mechanical stress, and an encapsulant that fully covers the package to protect against thermal and physical stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor devices are integrated into a single package, then productivity and cost efficiency are improved, but thermal and mechanical stresses increase leading to reliability issues
Solution Approach 1:
The patent introduces an interposer as an intermediary component between semiconductor devices to manage thermal and mechanical stresses. The interposer includes through-semiconductor vias (TSVs) that facilitate stress distribution and thermal management, acting as a mediator that enables high-density integration while maintaining package reliability
Solution Approach 2:
The patent employs composite material structures including underfill materials with specific mechanical properties, corner padding materials, and encapsulant materials that combine different properties to simultaneously address thermal management, mechanical stress relief, and structural support in the integrated package
2Stability of the object's composition
If semiconductor devices are bonded with connectors and underfill materials, then mechanical stability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies underfill materials and corner padding materials during the bonding process itself, performing protective and stabilizing actions preliminarily before the package undergoes subsequent processing. This preliminary application of materials ensures mechanical stability is established early in manufacturing
Solution Approach 2:
The patent implements a nested structure where corner padding materials are positioned at specific corners of semiconductor devices, which are then embedded within the broader underfill material matrix, creating a multi-layered protective structure that enhances stability while following a systematic manufacturing sequence
3Object-affected harmful factors
If an encapsulant fully covers the package, then protection against thermal and physical stresses is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent modifies material parameters by selecting encapsulant materials with specific thermal expansion coefficients that match the composite package structure, and by controlling the curing temperature and viscosity parameters during encapsulation processing to achieve complete coverage without excessive precision requirements
Solution Approach 2:
The patent applies corner padding materials and underfill materials beforehand to create a cushioning layer that compensates for potential stress concentrations and dimensional variations, allowing the encapsulant to be applied with relaxed precision requirements while still achieving complete protective coverage
Data Source
AI summary
Semiconductor package includes interposer, dies, encapsulant. Each die includes active surface, backside surface, side surfaces. Backside surface is opposite to active surface. Side surfaces join active surface to backside surface. Encapsulant includes first material and laterally wraps dies. Dies are electrically connected to interposer and disposed side by side on interposer with respective backside surfaces facing away from interposer. At least one die includes an outer corner. A rounded corner structure is formed at the outer corner. The rounded corner structure includes second material different from first material. The outer corner is formed by backside surface and a pair of adjacent side surfaces of the at least one die. The side surfaces of the pair have a common first edge. Each side surface of the pair does not face other dies and has a second edge in common with backside surface of the at least one die.