Rounded Interconnect Ablation for IC Packaging Precision
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Solution Overview
Problem
The challenge lies in developing an integrated circuit packaging system that achieves miniaturization, increased density, and cost reduction while addressing the limitations of existing technologies that fail to fully integrate more functions and reduce costs effectively in portable electronic devices.
Innovation Solution
The method involves forming a rounded interconnect on a package carrier, encapsulating it, and using an ablation tool to expose a surface area by calculating and aligning the tool over the estimated center of the interconnect, allowing for precise removal of encapsulation material to enhance connectivity and reduce physical space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional packaging methods are used, then manufacturing is simpler, but productivity is lower and position accuracy is poor
Solution Approach 1:
The system performs preliminary actions by calculating the estimated center position of the rounded interconnect before the ablation process. This pre-calculation enables the ablation tool to be precisely positioned, reducing actual ablation time and improving productivity without requiring complex real-time adjustments during the ablation process itself.
Solution Approach 2:
The invention replaces traditional mechanical alignment and positioning methods with a computational approach. By using calculated estimated centers and automated tool positioning based on these calculations, the system substitutes manual or mechanical alignment procedures, thereby reducing ablation time and improving position accuracy while maintaining manageable system complexity.
2Manufacturing precision
If alignment precision is improved, then position accuracy increases, but manufacturing complexity increases
Solution Approach 1:
The system employs a self-service approach where the rounded interconnect itself provides the reference for alignment. By calculating the estimated center based on the interconnect's geometry and position, the system uses the component's own characteristics for self-alignment, eliminating the need for external alignment fixtures or complex alignment procedures.
Solution Approach 2:
The invention implements a feedback mechanism where the calculated estimated center of the rounded interconnect feeds back into the positioning of the ablation tool. This closed-loop approach ensures that the tool is automatically positioned at the correct location, improving position accuracy while the automation reduces the perceived manufacturing complexity.
3Quantity of substance
If packaging density is increased, then space utilization improves, but manufacturing precision requirements increase
Solution Approach 1:
The system addresses the increased precision requirements by changing the approach to positioning. Instead of relying on fixed mechanical tolerances, the invention calculates the estimated center position dynamically, allowing the ablation tool to adapt to variations in interconnect placement. This parameter-based positioning method enables high packaging density while maintaining the necessary manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases productivity and quality by reducing ablation time and improving position accuracy, enabling finer ball pitches and eliminating solder bridges, thus enhancing the integration and reliability of packaging systems.
Implementation Method 1
removing a portion of the encapsulation over the rounded interconnect with an ablation tool
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a rounded interconnect on a package carrier having an integrated circuit attached thereto, the rounded interconnect having an actual center; forming an encapsulation over the package carrier covering the rounded interconnect; removing a portion of the encapsulation over the rounded interconnect with an ablation tool; calculating an estimated center of the rounded interconnect; aligning the ablation tool over the estimated center; and exposing a surface area of the rounded interconnect with the ablation tool.