Rounded Interconnect Packaging for IC Density and Yield
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Solution Overview
Problem
The challenge lies in developing an integrated circuit packaging system that achieves miniaturization, increased packaging density, improved performance, and reduced costs, while addressing the limitations of existing technologies that fail to fully integrate more functions within smaller physical spaces and higher performance requirements in portable devices.
Innovation Solution
The system incorporates a package carrier with a rounded interconnect and encapsulation, featuring a molding phase with a mold chase and an ablation phase using a laser ablation tool to expose the interconnect, ensuring precise alignment and reduced manufacturing time and cost, thereby enhancing yield and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional interconnect structures are used in integrated circuit packaging, then manufacturing processes are simpler, but the packaging density and miniaturization are limited
Solution Approach 1:
The patent employs rounded interconnect structures instead of conventional sharp-cornered geometries. The rounded shape allows for more efficient space utilization and higher packaging density while maintaining structural integrity during the molding process, thereby enabling miniaturization without excessive complexity
Solution Approach 2:
The patent pre-forms the rounded interconnect structures before the final molding process. This preliminary formation of the interconnect geometry allows the encapsulation material to flow around the rounded features more easily, reducing manufacturing complexity while achieving high packaging density
2Reliability
If sharp-cornered interconnect structures are used, then manufacturing is easier, but resin bleed and contamination defects occur
Solution Approach 1:
The rounded interconnect structures eliminate sharp corners that cause resin bleed and contamination during molding. The curved surfaces allow for smoother material flow and reduced defect formation, improving yield while the rounding process itself is integrated into the manufacturing workflow
Solution Approach 2:
The patent modifies the geometric parameters of the interconnect structures by rounding the corners and edges. This parameter change from sharp to rounded geometry fundamentally alters the molding behavior, reducing resin bleed and contamination while the rounding process is incorporated into the manufacturing sequence
3Adaptability or versatility
If more integrated circuits are integrated into a single package, then functionality increases, but physical space requirements increase
Solution Approach 1:
The rounded interconnect structures enable more compact arrangement of integrated circuits within the package footprint. The space-efficient geometry allows circuits to be nested more densely, increasing integration density without proportionally increasing the overall package area
Solution Approach 2:
The patent utilizes three-dimensional packaging arrangements enabled by the rounded interconnect structures. By transitioning from planar to spatial utilization, multiple integrated circuits can be stacked or arranged in vertical configurations, increasing integration density while maintaining a compact package footprint
4Reliability
If conventional molding processes are used, then manufacturing is faster, but defects like snowman defect and resin bleed occur
Solution Approach 1:
The rounded interconnect structures are pre-formed before the molding process, allowing the encapsulation material to flow around the rounded features more easily. This preliminary preparation eliminates the need for post-molding defect repair and reduces resin bleed, improving reliability without significantly extending the manufacturing cycle
Solution Approach 2:
The geometric parameter change to rounded interconnect structures fundamentally alters the molding dynamics. The rounded geometry reduces stress concentrations and improves material flow, eliminating defects like snowman defect and resin bleed while maintaining efficient molding cycle times
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved yield and reliability by minimizing resin bleed and contamination, eliminating defects like the snowman defect, and providing a robust stacking joint with mechanical strength, while reducing manufacturing time and cost.
Implementation Method 1
an ablation phase using a laser ablation tool to expose the interconnect
Data Source
AI summary
An integrated circuit packaging system includes: a package carrier; an integrated circuit attached to the package carrier; a rounded interconnect on the package carrier; and an encapsulation over the package carrier covering the integrated circuit and exposing the rounded interconnect having a characteristic free of denting.