Rounded Nanoribbon Channels With Regrown Caps for Uniform Gate Deposition

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Solution Overview

Problem

Current nanoribbon-based transistors often have non-ideal shapes, leading to gaps between adjacent nanoribbons where the gate electrode is not formed, which reduces device performance due to residual sacrificial material and non-uniform nanoribbon thickness.

Innovation Solution

The nanoribbons are etched to produce rounded shapes, and additional channel material is grown over them, forming a cap or outer layer, allowing the gate dielectric and gate electrode to be deposited uniformly between nanoribbons, eliminating gaps and improving performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If conventional nanoribbon processing techniques are used, then nanoribbons can be formed, but they have non-ideal shapes with non-uniform thickness leading to gaps between adjacent nanoribbons

Engineering Contradiction:
Improvenanoribbon shape uniformityVSAvoidgap formation between nanoribbons
Core Design Contradiction:
ShapeVSManufacturing precision

Solution Approach 1:

The nanoribbon cross-section is transformed from a non-uniform shape to a rounded shape with uniform thickness. The rounding process creates a curved profile that eliminates the non-ideal shape characteristics, ensuring consistent nanoribbon thickness throughout the cross-section and preventing gap formation between adjacent nanoribbons during gate electrode deposition.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Ease of manufacture

If gate electrode is deposited around non-rounded nanoribbons, then gate structure can be formed, but gaps remain between adjacent nanoribbons where gate electrode is not formed

Engineering Contradiction:
Improvegate electrode depositionVSAvoiddevice performance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The nanoribbon cross-section is pre-rounded before gate electrode deposition to ensure that the subsequent gate material can be uniformly deposited around all nanoribbons. This preliminary shape modification prevents the formation of gaps between adjacent nanoribbons, ensuring complete gate electrode coverage and reliable device performance.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If additional channel material is grown over rounded nanoribbons, then outer layer is formed, but process complexity increases

Engineering Contradiction:
Improvenanoribbon thickness uniformityVSAvoidprocessing steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Additional channel material is grown selectively over the rounded nanoribbon cross-section to form an outer layer. This local material addition enhances the nanoribbon structure where needed while maintaining the rounded profile, achieving superior thickness uniformity without requiring complete restructuring of the entire device architecture.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The rounded nanoribbon channels enable complete deposition of gate materials, enhancing device performance by reducing columbic scattering and improving the overall functionality of nanoribbon-based transistors.

Implementation Method 1

The nanoribbons are etched to produce rounded shapes

Methodology Applied
Scientific EffectEtching:

Implementation Method 2

additional channel material is grown over the rounded nanoribbons, forming a cap or outer layer

Methodology Applied
Scientific EffectMaterial growth/deposition: Deposition (physical)

Data Source

PatentUS20240321962A1Rounded nanoribbons with regrown caps
Publication Date: 2024.09.26 INTEL CORP
  • US20240321962A1 patent drawing
  • US20240321962A1 patent drawing
  • US20240321962A1 patent drawing

AI summary

Described herein are nanoribbon-based transistor devices in which the nanoribbons have rounded cross-sections. The nanoribbons may include caps or outer layers of semiconductor channel material grown over an inner layer of semiconductor channel material. Different materials may be used for the outer layers of NMOS and PMOS transistors. In one example, an integrated circuit device includes NMOS transistors formed from or more nanoribbons with rounded cross-sections and an outer layer of silicon, and a PMOS transistors formed from or more nanoribbons with rounded cross-sections and an outer layer of silicon germanium.