Rounded Printed Contacts for High-Precision Microcomponent Interconnects
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Solution Overview
Problem
Current methods for connecting small electronic components to substrates are slow, complex, and expensive, particularly for miniaturized electronic systems where the smallest components have dimensions below 200 μm and require precise electrical connections.
Innovation Solution
The use of printed structures with rounded substrate electrical contacts coated with a conductive material, allowing for efficient electrical connections through micro-transfer printing without the need for photolithographic processes, where the conductive material can reflow to conform to device contacts and improve contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithographic methods are used to form electrical connections, then connection precision can be achieved, but the process becomes slow, complex, and expensive
Solution Approach 1:
The patent extracts the electrical connection formation from the complex photolithographic process by using pre-formed conductive bumps on transfer stamps. These bumps are directly transferred to contact pads, eliminating the need for photolithographic patterning, metal evaporation, and etching steps while maintaining precise electrical connections.
Solution Approach 2:
The conductive bumps are prepared in advance on the transfer stamp before the actual connection process. This preliminary formation of conductive structures allows for rapid transfer and connection without performing complex fabrication steps during the assembly process, thereby simplifying the overall process while maintaining precision.
2Volume of moving object
If component size is reduced below 200 μm for miniaturization, then electronic system density increases, but conventional connection methods become inadequate
Solution Approach 1:
The patent uses spherical or hemispherical conductive bumps instead of flat contacts. This curved geometry provides mechanical compliance that allows the bumps to deform and conform to the contact pads, ensuring reliable electrical and mechanical contact even when component dimensions are reduced below 200 μm. The rounded shape accommodates manufacturing tolerances and thermal expansion differences.
Solution Approach 2:
The patent changes the physical state and properties of the conductive material by using reflowable solder or conductive paste in the bumps. Heating causes the material to soften and flow, improving wetting and contact area with the contact pads. This parameter change (from solid to softened state) enhances connection reliability for miniaturized components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and cost-effective electrical connections for small electronic components, reducing processing steps and material costs while achieving high-resolution connections, even for components with dimensions as small as 1-5 microns, thus facilitating the miniaturization of electronic systems.
Implementation Method 1
the conductive material can reflow to conform to device contacts and improve contact area
Data Source
AI summary
A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.