Routable Array Metal IC Package Partial Etching
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Solution Overview
Problem
Integrated circuit packaging faces challenges in protecting fragile dies, managing heat, and providing reliable electrical connections while maintaining compact size and controlling costs, as conventional processes require complex and costly packaging solutions that can be prone to mechanical damage and are limited in routing capabilities.
Innovation Solution
A routable array metal integrated circuit package is fabricated using a partial etching process on a metal substrate, where a sacrificial base layer is patterned and etched to form wire bond pads and external connection pads, allowing for flexible routing of metal traces under the die area, and a non-conductive adhesive is used to attach the die, enabling wire bonding and encapsulation without etching through the substrate, thus minimizing handling damage and facilitating easier assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging processes are used to protect the die and provide electrical connections, then reliability and protection are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple packaging functions into a single integrated metal substrate structure. The substrate simultaneously provides mechanical support, electrical connections through etched traces, heat dissipation pathways, and structural protection for the die. This integration eliminates the need for separate packaging components and complex assembly processes, directly resolving the contradiction between reliability/protection and device complexity.
2Adaptability or versatility
If the metal substrate is fully etched to create routing paths, then routing capabilities are improved, but structural strength and mechanical integrity deteriorate
Solution Approach 1:
The patent applies partial etching to the metal substrate, creating routing paths and connection points only where needed rather than completely removing material throughout. This partial action provides sufficient routing capability for electrical connections while preserving the overall structural integrity and mechanical strength of the substrate, directly resolving the contradiction between adaptability and strength.
3Temperature
If complex packaging structures are used to manage heat and provide protection, then heat management and protection are improved, but manufacturing cost increases
Solution Approach 1:
The metal substrate is designed to perform multiple functions simultaneously: it provides mechanical support, electrical connections, heat dissipation, and structural protection. By making the substrate multi-functional, the patent eliminates the need for separate heat sinks, mounting brackets, and protective housings, thereby reducing manufacturing complexity and cost while maintaining effective heat management and protection.
4Volume of moving object
If the die is kept small for easy integration, then device compactness is improved, but handling and connection difficulty increase
Solution Approach 1:
The patent merges the small die with the integrated metal substrate packaging structure into a single compact assembly. The substrate provides immediate mechanical support and structural protection to the small die, making the combined unit easy to handle and integrate despite the die's small size. This merging resolves the contradiction by providing handling ease at the assembly level while maintaining the compact die size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in thinner, cost-effective packages with enhanced routing capabilities, reduced mechanical damage during handling, and improved heat management, enabling the creation of compact, reliable, and efficient integrated circuit assemblies suitable for portable devices.
Implementation Method 1
a sacrificial base layer is patterned and etched to form wire bond pads and external connection pads
Implementation Method 2
a non-conductive adhesive is used to attach the die
Data Source
AI summary
An integrated circuit assembly is fabricated on a metal substrate strip in an array format that has raised circuitry pattern formed by photolithographic and metal etching processes. The circuitry pattern is formed on one side of the metal substrate only. The raised circuitry's etch depth extends partially through the metal substrate. Die attachment can be performed using a non-conductive material applied directly onto and around the raised circuitry features directly under the die. After wirebond and molding processes, the molded metal substrate strip assembly is processed through a metal etching process to remove the metal substrate portion that is exposed beyond the mold cap. A solder mask coating can be applied to protect the metal circuitry and to define the package pad opening to form Land-Grid-Array (LGA) packages. Solder balls can also be attached to form Ball-Grid-Array (BGA) packages.