Routable Heat Spreader Layout for 3D Chip Cooling and Low Latency
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Solution Overview
Problem
Conventional semiconductor devices face challenges in effectively dissipating heat generated by complex chips, leading to degraded circuit performance and increased latency due to physical separation of sensors and processors, which results in longer data transfer paths.
Innovation Solution
A routable heat spreader (RHS) is integrated into semiconductor devices, formed from thermally and electrically conductive materials like copper, with etched gaps filled with insulating material to create isolated terminals, allowing 3D stacking and reduced form factor, while providing heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used, then heat can be dissipated, but device complexity increases and form factor increases
Solution Approach 1:
The patent combines the heat spreader and interconnect structure into a single integrated component. The heat spreader is formed with conductive terminals that directly electrically connect to circuit boards, merging thermal management and electrical connectivity functions into one element, thereby reducing device complexity while maintaining effective heat dissipation
Solution Approach 2:
The heat spreader serves multiple functions simultaneously: it dissipates heat from the processor, provides electrical interconnects to circuit boards, and maintains structural support. This multi-functionality eliminates the need for separate heat sinks and connection components, reducing overall device complexity
2Reliability
If sensors are physically separated from processors, then isolation is provided, but latency increases due to longer data transfer paths
Solution Approach 1:
The patent transitions from traditional planar layout to three-dimensional stacking architecture. Sensors are positioned on different layers above the processor, with vertical interconnects providing direct electrical pathways through the heat spreader. This vertical arrangement maintains functional isolation while dramatically shortening data transfer paths, thereby reducing latency
3Ease of operation
If heat spreader material is made electrically conductive, then electrical connectivity is provided, but thermal management performance may be compromised
Solution Approach 1:
The heat spreader incorporates regions with different electrical conductivities: highly conductive terminal regions for electrical connections and thermally conductive but electrically isolated regions for heat dissipation. The terminal portions are designed to be electrically conductive to interface with circuit boards, while the main heat spreading area maintains optimal thermal properties through geometric design and material selection
Solution Approach 2:
The heat spreader is segmented into functionally distinct zones: electrically conductive terminals for connectivity and thermally conductive isolated regions for heat management. This segmentation allows each region to be optimized for its specific function without compromising the other
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The RHS reduces latency by enabling short interconnect lengths and efficient heat dissipation, maintaining isolation between sensors and PCBs, and minimizing package warpage, thus enhancing overall device performance.
Implementation Method 1
a routable heat spreader (RHS) configured to provide heat dissipation functionality
Implementation Method 2
Each terminal may be electrically isolated from a remainder of the RHS and electrically coupled to one of the one or more second contact terminals
Data Source
AI summary
A semiconductor device may include a circuit substrate, a processor device, and a routable heat spreader (RHS). The circuit substrate may include a build-up portion formed from multiple layers including metal layers separated by dielectric layers and including interconnections between at least some of the metal layers. The circuit substrate may include multiple contact terminals including a first contact terminal and one or more second contact terminals. The processor device may include a first side and a second side. The processor device may be coupled to the first contact terminal on the first side. The RHS may be formed from a thermally conductive and electrically conductive material and may extend over the second side of the processor device. The RHS may include one or more conductive terminals electrically isolated from a remainder of the RHS and electrically coupled to one of the one or more second contact terminals.