Routable Heat Spreader Layout for 3D Chip Cooling and Routing
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Solution Overview
Problem
Conventional semiconductor devices face challenges in effectively dissipating heat generated by complex chips, leading to degraded circuit performance and increased latency due to physical separation between sensors and processors.
Innovation Solution
A routable heat spreader (RHS) is integrated into semiconductor devices, formed from thermally and electrically conductive materials like copper, with etched gaps filled with insulating material to provide electrical terminals, allowing 3D stacking and reduced form factor, while maintaining heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat spreaders are used, then heat dissipation is provided, but electrical connectivity and routing capability are lost
Solution Approach 1:
The heat spreader is segmented into multiple electrically isolated terminals by etching gaps and filling them with dielectric material. This allows the heat spreader to provide both thermal conduction across its entire surface and electrical connectivity through isolated contact regions, resolving the contradiction between heat dissipation and electrical routing capability
Solution Approach 2:
The heat spreader is designed to perform multiple functions simultaneously: it acts as a thermal conduction path for heat dissipation while also serving as an electrical interconnect structure with multiple routed terminals. This multi-functionality eliminates the need for separate heat spreader and electrical interconnect components
2Ease of manufacture
If sensors are physically separated from processors, then packaging is simplified, but latency increases due to longer interconnects
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional stacking by implementing vertical interconnects through the heat spreader. Sensors and processors are stacked in different layers with electrical connections routed vertically through the heat spreader terminals, reducing lateral distance and latency while maintaining packaging simplicity
Solution Approach 2:
The heat spreader serves as an intermediary structure that enables direct electrical coupling between sensors and processors through its routed terminals. This intermediary structure provides both mechanical support and electrical interconnection, eliminating the need for separate interconnect layers and reducing signal path length
3Adaptability or versatility
If complex interconnect routing is implemented, then electrical connectivity is improved, but package warpage increases
Solution Approach 1:
Complex interconnect routing is extracted and integrated directly into the heat spreader structure itself. The heat spreader is etched with routing paths and filled with dielectric material to create embedded electrical interconnects, eliminating the need for separate complex interconnect layers and reducing overall package stress and warpage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The RHS reduces latency and package warpage by enabling short interconnects and isolating sensors from the PCB, facilitating efficient heat dissipation and electrical routing, thus improving circuit performance and reducing physical separation delays.
Implementation Method 1
a routable heat spreader (RHS) configured to provide heat dissipation functionality
Implementation Method 2
Each conductive terminal is separated from surrounding material of the RHS and from others of the conductive terminals by a thermally conducting dielectric material
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
A semiconductor device may include a circuit substrate, a processor device, and a routable heat spreader (RHS). The circuit substrate may include a build-up portion formed from multiple layers including metal layers separated by dielectric layers and including interconnections between at least some of the metal layers. The circuit substrate may include multiple contact terminals including a first contact terminal and one or more second contact terminals. The processor device may include a first side and a second side. The processor device may be coupled to the first contact terminal on the first side. The RHS may be formed from a thermally conductive and electrically conductive material and may extend over the second side of the processor device. The RHS may include one or more conductive terminals electrically isolated from a remainder of the RHS and electrically coupled to one of the one or more second contact terminals.